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A kind of epoxy resin latent curing agent containing imidazole group and preparation method thereof

A latent curing agent, epoxy resin technology, applied in the curing agent and its preparation, epoxy resin latent curing agent and its preparation field, can solve the problem of no latent curing agent and the like

Active Publication Date: 2021-12-28
广东固研电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is no report in the prior art that the method is used to prepare imidazole-containing latent curing agent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Example 1 41g of 2-methylimidazole and 17g of diethylenetriamine were mixed, and 111g of isophorone diisocyanate was added, and the reaction proceeded automatically and exothermic violently. After the temperature no longer rises, add 82g of bisphenol F epoxy resin (EEW170) and 12g of polyoctyl methacrylate, melt and stir to raise the temperature to 160°C. Cool down to room temperature to obtain a brown brittle solid. Grind with a jet mill for later use.

Embodiment 2

[0021] Example 2 Mix 72g 2-methylimidazole and 17g isophorone diamine, add 42g 1.6-hexamethylene diisocyanate, add 85g novolac epoxy resin (EEW250) and 5g polybutylmethacrylate after the reaction is uniform, continue Raise the temperature to 180°C and cool down to room temperature naturally to obtain a light brown solid. Grind with a jet mill for later use.

Embodiment 3

[0022] Example 3 Mix 72g of 2-phenylimidazole and 7g of isophorone diamine, add 55g of isophorone diisocyanate, add 95g of liquid bisphenol A epoxy resin (EEW190) and 10g of polymethacrylic acid after the reaction Octyl ester, heated up to 150 ° C, and after cooling down to room temperature, a light brown solid was obtained. Grind with a jet mill for later use.

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PUM

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Abstract

The invention discloses an epoxy resin latent curing agent containing imidazole groups and a preparation method thereof. The latent curing agent of the present invention is prepared by melting and reacting imidazole compounds, polyamines, isocyanates, epoxy resins and polymethacrylates at a ratio of 5-45% at 80-180°C, cooling and pulverizing. The raw materials used in the latent curing agent of the present invention are common products in the market, are cheap and easy to obtain, and have a simple process. The prepared curing agent can be cured at medium and low temperatures, has a long pot life, excellent heat resistance, and high bonding strength.

Description

technical field [0001] The invention relates to a curing agent and a preparation method thereof, in particular to an epoxy resin latent curing agent containing imidazole groups and a preparation method thereof, belonging to the technical field of organic synthesis. Background technique [0002] Epoxy resin is a kind of thermosetting resin, which is widely used in the fields of electronic appliances, aerospace, composite panels and building reinforcement, and is usually made into adhesives, coatings, inks, circuit boards and fiber-based composite materials. However, epoxy resin itself is thermoplastic and has no practical value. It must be cross-linked with curing agents such as polyamines, acid anhydrides, phenolic aldehydes, and tertiary amines to have practical value. Once the above-mentioned curing agent is mixed with epoxy resin, it must be used up in a short time, otherwise it will gel and make it unusable, which not only causes waste of materials, but also the batching...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08L63/00C08L63/04C08L33/10
CPCC08G59/5073C08L63/00C08L63/04C08L33/10
Inventor 康富春唐增花刘海明
Owner 广东固研电子材料有限公司