A kind of epoxy resin latent curing agent containing imidazole group and preparation method thereof
A latent curing agent, epoxy resin technology, applied in the curing agent and its preparation, epoxy resin latent curing agent and its preparation field, can solve the problem of no latent curing agent and the like
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Embodiment 1
[0020] Example 1 41g of 2-methylimidazole and 17g of diethylenetriamine were mixed, and 111g of isophorone diisocyanate was added, and the reaction proceeded automatically and exothermic violently. After the temperature no longer rises, add 82g of bisphenol F epoxy resin (EEW170) and 12g of polyoctyl methacrylate, melt and stir to raise the temperature to 160°C. Cool down to room temperature to obtain a brown brittle solid. Grind with a jet mill for later use.
Embodiment 2
[0021] Example 2 Mix 72g 2-methylimidazole and 17g isophorone diamine, add 42g 1.6-hexamethylene diisocyanate, add 85g novolac epoxy resin (EEW250) and 5g polybutylmethacrylate after the reaction is uniform, continue Raise the temperature to 180°C and cool down to room temperature naturally to obtain a light brown solid. Grind with a jet mill for later use.
Embodiment 3
[0022] Example 3 Mix 72g of 2-phenylimidazole and 7g of isophorone diamine, add 55g of isophorone diisocyanate, add 95g of liquid bisphenol A epoxy resin (EEW190) and 10g of polymethacrylic acid after the reaction Octyl ester, heated up to 150 ° C, and after cooling down to room temperature, a light brown solid was obtained. Grind with a jet mill for later use.
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