Composite type filtered arc ion plating with composite magnetic field and lined bias voltage stepped tube
A technology of arc ion plating and arc plasma, which is applied in the field of material surface treatment, can solve problems such as large particle defects, pollution, vacuum chamber space and deposition position limitations, and achieve effective control, improve utilization efficiency, and ensure uniformity Effect
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specific Embodiment approach 1
[0020] Specific implementation mode one: the following combination figure 1 , 2 and 3 illustrate the present embodiment, the present embodiment combines the magnetic field and the arc ion plating of the liner bias stepped tube compound type filter, and the device used includes the bias power supply (1), the arc power supply (2), the arc ion plating target source (3 ), multi-stage magnetic field device (4), multi-stage magnetic field power supply (5), lined bias ladder tube device (6), lined bias power supply (7), movable coil device (8), movable coil device power supply ( 9), rheostat device (10), sample stage (11), bias power waveform oscilloscope (12) and vacuum chamber (13);
[0021] In this device:
[0022] The substrate workpiece to be processed is placed on the sample stage (11) in the vacuum chamber (13), the multi-stage magnetic field device (4), the lined bias voltage ladder tube device (6), the movable coil device (8) and the vacuum chamber (13 ) are insulated fro...
specific Embodiment approach 2
[0036] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the device can also realize other functions: it can combine traditional DC magnetron sputtering, pulse magnetron sputtering, traditional arc ion plating and pulse cathode arc Combination of one or more than two methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device on the workpiece for thin film deposition to prepare pure metal thin films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structures.
specific Embodiment approach 3
[0037] Embodiment 3: The difference between this embodiment and Embodiment 2 is that the combined magnetic field is connected to the arc ion plating of the composite filter of the lined bias ladder tube, the arc power supply (2) is turned on, and the multi-stage magnetic field power supply (5 ) Adjust the multi-level magnetic field device (4), turn on the liner bias power supply (7), the liner bias step tube device (6) maintains a positive DC bias, turn on the bias power supply (1), and turn on the power supply of the movable coil device ( 9) Adjust the movable coil device (8), adjust the output resistance of the rheostat device (10), adjust the process parameters, perform film deposition, and prepare multi-layer structure films with different stress states, microstructures and element ratios, and others are the same as in Embodiment 2 same.
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