Vacuum deposition method with magnetic field combining and liner bias conical pipe and straight pipe compounding
A technology of vacuum deposition and conical tube, applied in vacuum evaporation plating, ion implantation plating, coating, etc., can solve the problems of film composition pollution, large particle defects, low film deposition efficiency, etc., to ensure uniformity, The effect of improving utilization efficiency
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specific Embodiment approach 1
[0025] Specific implementation mode one: the following combination Figure 1-4 Describe this embodiment. In this embodiment, a vacuum deposition method in which a combined magnetic field is combined with a lined bias conical tube and a straight tube is used. The device used includes a bias power supply (1), an arc power supply (2), and an arc ion plating target source. (3), high-power pulse magnetron sputtering power supply (4), high-power pulse magnetron sputtering target source (5), bias power supply waveform oscilloscope (6), high-power pulse magnetron sputtering power supply waveform oscilloscope (7 ), waveform synchronous matching device (8), movable coil device (9), movable coil device power supply (10), rheostat device (11), multi-stage magnetic field device (12), multi-stage magnetic field device power supply (13), lining Bias conical tube and straight tube combination device (14), lining bias power supply (15), sample stage (16) and vacuum chamber (17);
[0026] In t...
specific Embodiment approach 2
[0044] Embodiment 2: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum deposition method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and control the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously by the waveform synchronous matching device (8). The period of the output pulse of the power pulse magnetron sputtering power supply (4) is an integer multiple of the output pulse of the bia...
specific Embodiment approach 3
[0045] Embodiment 3: The difference between this embodiment and Embodiment 1 is that a combined magnetic field is connected with a vacuum deposition method in which the lining bias conical tube and the straight tube are combined, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (12), turns on the lining bias power supply (15), adjusts the bias voltage of the liner bias conical tube and straight tube combination device (14), and turns on the movable coil device power supply (10 ) adjust the movable coil device (9), adjust the output resistance of the rheostat device (10), and control the bias power supply (1) and the high-power pulse magnetron sputtering power supply (4) to be turned on simultaneously by the waveform synchronous matching device (8). Power pulse magnetron sputtering power supply (4) outputs high-power pulses and bias voltage pulse waveform output by bias power supply (1) i...
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