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Laser activable high temperature resistant thermoplastic composition and preparation method thereof

A technology of laser activation and composition, which is applied in the field of thermoplastic compositions, can solve the problems of low tensile strength, low punching fracture strength, and high water absorption of materials, and achieve the effects of improving dispersion, improving solubilization, and reducing damage

Inactive Publication Date: 2019-08-02
SHENZHEN SPHONSUN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a laser-activatable high-temperature-resistant thermoplastic composition and a preparation method thereof to solve the problems of low tensile strength, low notch fracture strength and material water absorption rate of existing laser-activatable high-temperature-resistant thermoplastic composition materials. higher technical issues

Method used

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  • Laser activable high temperature resistant thermoplastic composition and preparation method thereof
  • Laser activable high temperature resistant thermoplastic composition and preparation method thereof
  • Laser activable high temperature resistant thermoplastic composition and preparation method thereof

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preparation example Construction

[0034] The present invention also provides a method for preparing the above-mentioned laser-activatable high-temperature-resistant thermoplastic composition, which includes the following steps;

[0035] S1: Drying, drying the thermoplastic high temperature resistant resin at 100-160°C;

[0036] S2: Premixing, according to the weight percentage, PAI, PI or organic titanium liquid surface modifier; 0.60%-3.00% and redox graphene (RGO): 0.60%-0.90% were stirred at 50°C for more than 6 hours, Get component 1.

[0037] S3 granulation, according to weight percentage, LDP additive: 8.00%-12.00%; thermoplastic high-temperature resistant resin: 80.50%-88.50%; rubber solubilizing polymer: 1.00%-3.00%; high-temperature resistant oxidant: 0.20%-0.50 %; Toner or high dielectric material: 0.10%-1.00% mixed with component 1 and granulated at 240-300°C, wherein the L / D value of the granulation equipment is controlled above 25, and the screw speed is not greater than 95RPM;

[0038] S4: pell...

Embodiment 1

[0042] The thermoplastic composition comprises the following components according to weight percentage:

[0043]

[0044] The preparation method of described thermoplastic composition, comprises the following steps:

[0045] S1: drying, drying the thermoplastic high temperature resistant resin at 120°C;

[0046] S2: premixing, according to the weight percentage, PAI liquid surface modifier; 3.00%; redox graphene (RGO): 0.70% at 50 ° C for more than 6 hours to obtain component 1.

[0047] S3: Granulating, according to weight percentage, LDP additive: 10.90%; thermoplastic high temperature resistant resin: 82.00%; rubber solubilizing polymer: 3.00%; high temperature resistant oxidant: 0.30%; colorant or high dielectric material: 0.10% % and component 1 are mixed and granulated at 240-300°C, wherein the L / D value of the granulation equipment is 25, and the screw speed is 95RPM to granulate to obtain the finished product;

[0048] S4: pelletizing, the pelletizing speed is 40-...

Embodiment 2

[0051] The thermoplastic composition comprises the following components according to weight percentage:

[0052]

[0053] The following lists more embodiments and their corresponding effects in the form of a table:

[0054]

[0055] The preparation method of described thermoplastic composition, comprises the following steps:

[0056] S1: drying, drying the thermoplastic high temperature resistant resin at 140°C;

[0057] S2: Premixing, according to the weight percentage, PI liquid surface modifier; 2.00%; redox graphene (RGO): 0.90% was finely mixed at 50°C for more than 6 hours to obtain component 1.

[0058] S3: Granulating, according to weight percentage, LDP additive: 9.10%; thermoplastic high temperature resistant LCP resin: 84.50%; rubber solubilizing polymer: 3.00%; high temperature resistant oxidant: 0.40%; colorant or high dielectric material: 0.10% mixed with component 1 and granulated at 240-300°C, wherein the L / D value of the granulation equipment is 25, an...

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Abstract

The invention discloses a laser activable high temperature resistant thermoplastic composition which can meet 3D-SMT and a preparation method thereof again. The thermoplastic composition is prepared from the following components in percentage by weight: 8.00 to 12.00 percent of an LDP additive, 80.50 to 88.50 percent of thermoplastic high temperature resistant resin, 1.00 to 3.00 percent of a rubber solubilized polymer, 0.60 to 3.00 percent of a surface modifier, 0.60 to 0.90 percent of RGO (Reduced Graphene Oxide), 0.20 to 0.5 percent of a high temperature resistant oxidizing agent, and 0.10to 1.00 percent of a colorant or a high dielectric material. The dispersity of the LDP additive and graphene of the composite product under the SEM and TEM imaging of a plurality of micro-areas is better. The tensile strength of the material is high; the punching fracture strength is high; and the material water adsorption rate is low. Under the same conditions, the prepared route is prolonged byover 8 hours by compared with the formula of the material in 201711290535.7 in a 85 percent high temperature and high humidity test at 85 DEG C. Components and devices can be directly mounted at the position of a three-dimensional surface line of the structural part formed by the material; structural space is fully utilized; and the requirements on high integrity, small size, light weight and three-dimensional surface assembly device are met.

Description

technical field [0001] The invention relates to a thermoplastic composition suitable for SMT, in particular to a laser-activatable high-temperature-resistant thermoplastic composition added with redox graphene (RGO) and a preparation method thereof. Background technique [0002] At present, the use of laser direct patterning (LDP) method to form conformal 3D circuits is more and more applied in mobile phones, automotive electronics, sensors and other products. In the LDP method, the three-dimensional dynamic laser beam moves on the product surface according to the line design at a certain speed, frequency and power and continuous zoom, thereby activating the plastic surface. With the help of the above laser direct patterning and fine metallization methods, fine conformal lines can be obtained on structural parts. The laser direct pattern (LDP) method realizes conformal lines on the surface of structural parts, which is obviously lightweight and miniaturized, and realizes th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L77/00C08L101/00C08K13/06C08K9/10C08K3/04
CPCC08L77/00C08L101/00C08L2201/08C08L2205/025C08L2205/08C08K13/06C08K9/10C08K3/042
Inventor 邓文刘可杨虎
Owner SHENZHEN SPHONSUN TECH CO LTD
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