High-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes and preparation method of conductive adhesive

A technology of carbon nanotubes and nanosilver, which is applied in the direction of conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of high brittle cost of thermal conductive adhesives, poor printability of pastes, and low thermal conductivity. Achieve the effects of improving dispersion performance, improving viscosity, and convenient operation

Inactive Publication Date: 2019-08-02
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the high thermal conductivity of metal silver and carbon nanotubes, they have been extensively studied as thermal conductive fillers in electronic pastes. Pure carbon nanotube-filled polymer resins have low thermal conductivity and are not easy to disperse; high silver additions can improve thermal conductivity. rate, but it will cause the printability of the paste to deteriorate, and the thermal and conductive adhesive with high silver content is brittle and the cost is high

Method used

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  • High-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes and preparation method of conductive adhesive
  • High-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes and preparation method of conductive adhesive
  • High-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes and preparation method of conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The nano-silver-modified carbon nanotubes are used to prepare high thermal and conductive adhesives, which are prepared from the following raw materials: 20 g of resin carrier, 65 g of silver powder, and 1 g of nano-silver-modified carbon nanotubes.

[0029] The preparation method of the nano-silver modified carbon nanotubes for preparing high thermal conductivity and electrical conductivity adhesive, the specific steps are as follows:

[0030] Step 1, preparation of nano-silver modified carbon nanotubes:

[0031] Add 10 g of carbon nanotubes into 50 mL of ethanol solution, disperse them with ultrasonic waves for 20 minutes under ice bath conditions, then add 10 g, 1 mol / L sodium dodecyl sulfate solution, and continue the supernatant dispersion for 1 h to obtain a suspension of carbon nanotubes. The carbon nanotube suspension is centrifuged and washed to prepare activated modified carbon nanotubes;

[0032] Add the obtained activated modified carbon nanotubes to 50g, 1...

Embodiment 2

[0038] The nano-silver-modified carbon nanotubes are used to prepare high thermal and conductive adhesives, which are prepared from the following raw materials: 35g of resin carrier, 80g of silver powder, and 5g of nano-silver-modified carbon nanotubes.

[0039] The preparation method of the nano-silver modified carbon nanotubes for preparing high thermal conductivity and electrical conductivity adhesive, the specific steps are as follows:

[0040] Step 1, preparation of nano-silver modified carbon nanotubes:

[0041]Add 15 g of carbon nanotubes into 100 mL of ethanol solution, and disperse them with ultrasonic waves for 25 minutes under ice bath conditions, then add 15 g, 1 mol / L sodium dodecyl sulfate solution, and continue the supernatant dispersion for 2 hours to obtain a suspension of carbon nanotubes. centrifuging and washing the suspension of carbon nanotubes to prepare activated modified carbon nanotubes;

[0042] Add the obtained activated modified carbon nanotubes t...

Embodiment 3

[0047] The nano-silver-modified carbon nanotubes are used to prepare high thermal and conductive adhesives, which are prepared from the following raw materials: 25g of resin carrier, 75g of silver powder, and 4g of nano-silver-modified carbon nanotubes.

[0048] The preparation method of the nano-silver modified carbon nanotubes for preparing high thermal conductivity and electrical conductivity adhesive, the specific steps are as follows:

[0049] Step 1, preparation of nano-silver modified carbon nanotubes:

[0050] Add 20 g of carbon nanotubes into 50 mL of ethanol solution, and disperse them by ultrasonic waves for 30 minutes in an ice bath, then add 20 g of 1 mol / L sodium dodecyl sulfate solution, and continue the supernatant dispersion for 1.5 h to obtain a suspension of carbon nanotubes. centrifuging and washing the suspension of carbon nanotubes to prepare activated modified carbon nanotubes;

[0051] Add the obtained activated modified carbon nanotubes to 60g, 1mol / L...

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Abstract

The invention relates to a high-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes and a preparation method of the conductive adhesive and belongs to the technical field of composite preparation. The high-thermal-conductivity conductive adhesive prepared from nano-silver modified carbon nanotubes is prepared from raw materials as follows: 20-35 parts of aresin carrier, 65-80 parts of silver powder and 1-5 parts of the nano-silver modified carbon nanotubes. The carrier and the silver powder with the particle size of 5 mu m are fully dispersed and mixedby a three-roll mill, the nano-silver modified carbon nanotubes, the dispersant and the defoaming agent are added, mixed slurry is obtained and then mixed by a centrifuge, and the high-thermal-conductivity conductive adhesive is prepared. According to the method, the carbon nanotubes modified with nano-silver are added to silver adhesive, heat conducting bridge linking is formed among micro-silver particles, nano-silver on surfaces of the carbon nanotubes and silver particles are sintered and linked, a large number of heat conducting paths are established, the carrier transport potential barrier among filler is reduced, and the transport efficiency of phonons and electrons among filler interfaces is substantially improved.

Description

technical field [0001] The invention relates to a nano-silver modified carbon nanotube for preparing high thermal conductivity and a preparation method thereof, belonging to the technical field of composite material preparation. Background technique [0002] As a thermal interface material with excellent performance, high thermal conductivity adhesive is widely used in ultra-high-speed computer chips, power semiconductor devices and high-brightness LEDs. It can realize the mechanical connection, electrical connection and Thermal connection and can meet the requirements of high temperature environment. Due to the high thermal conductivity of metal silver and carbon nanotubes, they have been extensively studied as thermal conductive fillers in electronic pastes. Pure carbon nanotube-filled polymer resins have low thermal conductivity and are not easy to disperse; high silver additions can improve thermal conductivity. rate, but it will cause the printability of the paste to d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J163/00C09J11/04C09J9/02
CPCC08K2201/001C08K2201/011C09J9/02C09J11/04C09J163/00C09J183/04C08L63/00C08K9/04C08K9/02C08K3/041C08K7/00C08L83/04C08K7/18
Inventor 甘国友黄宇宽张家敏杜景红严继康易健宏谷天鹏黄佳敏余向磊
Owner KUNMING UNIV OF SCI & TECH
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