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Method for removing active metal solder layer in aluminum nitride ceramic circuit board

A technology of aluminum nitride ceramics and active metals, which is applied in the field of ceramic metallization, can solve problems such as the inability to efficiently remove the metal welding layer and the short circuit of aluminum nitride ceramic circuit boards, and achieve the goals of avoiding short circuits, improving production efficiency and reducing production costs Effect

Active Publication Date: 2019-08-09
昆山市柳鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a method for removing the active metal welding layer in the aluminum nitride ceramic circuit board, aiming at solving the problem that the prior art cannot efficiently remove the metal welding layer in the aluminum nitride ceramic circuit board. layer, resulting in the short circuit of aluminum nitride ceramic circuit boards during use

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  • Method for removing active metal solder layer in aluminum nitride ceramic circuit board
  • Method for removing active metal solder layer in aluminum nitride ceramic circuit board

Examples

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Embodiment 1

[0037] A method for removing an active metal solder layer in an aluminum nitride ceramic circuit board, comprising the steps of:

[0038] 1) Etching away the copper layer at the preset non-circuit position in the aluminum nitride ceramic circuit board, so that the active metal welding layer in the aluminum nitride ceramic circuit board is exposed;

[0039] 2) Perform femtosecond laser scanning treatment on the active metal welding layer exposed in the aluminum nitride ceramic circuit board at a traveling speed of 6 m / min;

[0040] 3) Under ultrasonic conditions, use a prefabricated etchant to etch the active metal welding layer after laser scanning for 2 minutes, and remove the active metal welding layer at the preset non-circuit position in the aluminum nitride ceramic circuit board. The etching solution includes 8 parts by weight of hydrogen peroxide, 6 parts of nitric acid, 25 parts of hydrochloric acid and 30 parts of ammonium fluoride.

Embodiment 2

[0042] A method for removing an active metal solder layer in an aluminum nitride ceramic circuit board, comprising the steps of:

[0043] 1) Etching away the copper layer at the preset non-circuit position in the aluminum nitride ceramic circuit board, so that the active metal welding layer in the aluminum nitride ceramic circuit board is exposed;

[0044] 2) Perform picosecond laser scanning on the active metal welding layer exposed in the aluminum nitride ceramic circuit board at a traveling speed of 10 m / min;

[0045] 3) Under ultrasonic conditions, use a prefabricated etchant to etch the active metal welding layer after laser scanning for 1 min, and remove the active metal welding layer at the preset non-circuit position in the aluminum nitride ceramic circuit board. The etching solution includes 10 parts by weight of hydrogen peroxide, 8 parts of nitric acid, 30 parts of hydrochloric acid and 40 parts of sodium acetate.

Embodiment 3

[0047] A method for removing an active metal solder layer in an aluminum nitride ceramic circuit board, comprising the steps of:

[0048] 1) Etching away the copper layer at the preset non-circuit position in the aluminum nitride ceramic circuit board, so that the active metal welding layer in the aluminum nitride ceramic circuit board is exposed;

[0049] 2) Perform picosecond laser scanning on the active metal welding layer exposed in the aluminum nitride ceramic circuit board at a traveling speed of 20 m / min;

[0050] 3) Under ultrasonic conditions, use a prefabricated etching solution to etch the active metal welding layer that has undergone laser scanning treatment for 1.5 minutes, and remove the active metal welding layer at the preset non-circuit position in the aluminum nitride ceramic circuit board, The etching solution includes 20 parts by weight of hydrogen peroxide, 10 parts of nitric acid, 35 parts of hydrochloric acid and 55 parts of ammonium acetate.

[0051] I...

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Abstract

The invention discloses a method for removing an active metal solder layer in an aluminum nitride ceramic circuit board. The method comprises the steps: etching out the copper layer in the preset non-circuit position in the aluminum nitride ceramic circuit board so that the active metal solder layer in the aluminum nitride ceramic circuit board is enabled to be exposed; performing laser scanning treatment on the active metal solder layer; and etching the active metal solder layer subjected to the laser scanning treatment by an etching solution so as to remove the active metal solder layer in the preset non-circuit position in the aluminum nitride ceramic circuit board. The laser is applied to be cooperated with the etching solution to etch the active metal solder layer so that the production cost is effectively reduced and the production efficiency can be greatly improved. More importantly, the active metal solder layer in the aluminum nitride ceramic circuit board can be completely removed, the problem of short circuit occurring in the use process of the aluminum nitride ceramic circuit board can be effectively avoided, and the aluminum nitride ceramic circuit board can meet the use requirements of later discharge test and inter-line insulation voltage test.

Description

technical field [0001] The invention relates to the field of ceramic metallization, in particular to a method for removing an active metal welding layer in an aluminum nitride ceramic circuit board. Background technique [0002] At present, there are LTCC (low temperature sintered copper clad), HTCC (high temperature sintered copper clad), DBC (direct copper clad process), AMB (active metal welding) and other processes for ceramic metallization. The AMB process is a ceramic metal that uses active metals as solders. For the solution, the active metals include silver, titanium, nickel, etc., and it is more common to use silver, copper and titanium as the active solder. Aluminum nitride ceramic materials are widely used in IGBT high-power modules due to their excellent thermal conductivity (180-210W / ㎡·K) and excellent thermal expansion coefficient. Metallized products made of aluminum nitride through the AMB process are widely used in high-speed rail, wind power generation, el...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/107
Inventor 罗小阳张德库唐甲林刘飞杜山山
Owner 昆山市柳鑫电子有限公司