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A method for preparing a directional thermally conductive silicone gel composite sheet

A technology of composite sheet and heat-conducting silicon, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problem of low thermal conductivity of silicone gel, achieve controllable thermal conductivity and thickness, and improve thermal conductivity , the effect is obvious

Active Publication Date: 2021-03-09
哈工大郑州研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention solves the problem of low thermal conductivity of the existing silicone gel used in electronic components, and provides a method for preparing a directional thermally conductive silicone gel composite sheet

Method used

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  • A method for preparing a directional thermally conductive silicone gel composite sheet
  • A method for preparing a directional thermally conductive silicone gel composite sheet
  • A method for preparing a directional thermally conductive silicone gel composite sheet

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Experimental program
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specific Embodiment approach 1

[0023] Specific implementation mode one: combine figure 1 Specifically, a method for preparing a directional thermally conductive silicone gel composite sheet in this embodiment is carried out in the following steps:

[0024] 1. Preparation of close-packed diamond layer:

[0025] Dilute the surfactant with water to obtain a surfactant solution, add diamond particles into the surfactant solution, and stir for 5 minutes to 10 minutes to obtain a mixed solution. Under the condition of heating until the water evaporates to dryness, a close-packed diamond layer is obtained;

[0026] The mass percent of the surfactant in the surfactant solution is 1% to 5%; the average particle diameter of the diamond particles is 1 μm to 60 μm; the quality of the diamond particles and the surfactant in the surfactant solution The ratio is 1:(0.05~0.25); the thickness of the close-packed diamond layer is 30 μm~200 μm;

[0027] 2. Preparation of diamond / silicone gel composite materials:

[0028] ...

specific Embodiment approach 2

[0032] Embodiment 2: This embodiment differs from Embodiment 1 in that the diamond particles described in Step 1 are polycrystalline micron-sized diamond particles or single-crystal micron-sized diamond particles. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0033] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the surfactant described in step 1 is a high molecular weight cationic surfactant that is easily soluble in water. Others are the same as in the first or second embodiment.

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Abstract

A method for preparing a directional heat-conducting silicone gel composite sheet, the invention relates to a preparation method for a heat-conducting silicon gel composite sheet. The invention solves the problem of low thermal conductivity of silicone gels currently used in electronic components. Preparation method: 1. preparation of close-packed diamond layer; 2. preparation of diamond / silica gel composite material to obtain directional heat-conducting silica gel composite sheet. The invention is used for the preparation of directional heat-conducting silicone gel composite sheet.

Description

technical field [0001] The invention relates to a preparation method of a heat-conducting silicone gel composite sheet. Background technique [0002] Today, with the high power, high integration and three-dimensional integration of electronic components, the thermal management of chips has become the core technology that limits the development of next-generation electronic devices. At the temperature level of 70°C to 80°C, the reliability of GaN transistors decreases by 10% for every 2°C increase; the operating temperature of silicon-based oxide semiconductor transistor elements will affect the clock speed of the entire legacy circuit. [0003] There are microscopic ravines and gaps between the circuit and the heat sink. As long as it is dominated by air, it is a poor conductor of heat. Therefore, a thermal interface material with high thermal conductivity is required to increase the contact area and eliminate the air gap. Silicone gel has good elasticity and chemical corro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 朱嘉琦孙明琪代兵舒国阳赵柯臣王鹏杨磊刘康韩杰才
Owner 哈工大郑州研究院
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