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Surface mounting process for PCB

A surface mount technology, PCB board technology, applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuit manufacturing, etc., can solve problems such as solder paste spatter, and achieve the effect of reducing residues and reducing the probability of soldering voids

Inactive Publication Date: 2019-08-16
深圳市英创立电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the solder paste contains rosin, active agent, viscosity improver and solvent. The function of the solvent is mainly to serve as the carrier of rosin and improve the storage time of the solder paste. In the reflow soldering process, the workpiece coated with solder paste needs to be The reflow soldering furnace passes through the preheating zone, heat preservation zone, reflow soldering zone and cooling zone in turn. The existing preheating zone mainly uses heating to force the solvent and moisture in the solder paste to fully volatilize as much as possible, thereby avoiding tin The solvent and moisture in the paste volatilize during the reflow soldering process, resulting in splashing of the solder paste. However, with the increase of the current pad, the solvent and moisture in the solder paste need a longer distance to escape from the solder paste. out, which also leads to the problem that reflow soldering is prone to solder paste spatter

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment one: a kind of PCB board surface mount technology, comprises the following steps:

[0031] a. PCB board surface cleaning: Before the PCB board is mounted, the impurities and dust on the PCB board surface need to be cleaned. When cleaning, the PCB board is vibrated by ultrasonic waves, and the impurities and dust on the PCB board are shaken off the PCB board. , and then blow air to the PCB board, and remove the dust and impurities on the PCB board that have been shaken by the wind;

[0032] b. Printing solder paste: face the front of the PCB board, and print the solder paste on the PCB board where components need to be installed through a solder paste printing machine; when printing solder paste, it is necessary to ensure that the PCB board is in a horizontal position to prevent the position of the printed solder paste Deviation occurs;

[0033] c. Front component mounting: Mount the components that need to be installed on the PCB board, and use a placemen...

Embodiment 2

[0040] Embodiment two: a kind of PCB board surface mount technology, comprises the following steps:

[0041] a. PCB board surface cleaning: Before the PCB board is mounted, the impurities and dust on the PCB board surface need to be cleaned. When cleaning, the PCB board is vibrated by ultrasonic waves, and the impurities and dust on the PCB board are shaken off the PCB board. , and then blow air to the PCB board, and remove the dust and impurities on the PCB board that have been shaken by the wind;

[0042] b. Printing solder paste: face the front of the PCB board, and print the solder paste on the PCB board where components need to be installed through a solder paste printing machine; when printing solder paste, it is necessary to ensure that the PCB board is in a horizontal position to prevent the position of the printed solder paste Deviation occurs;

[0043] c. Front component mounting: Mount the components that need to be installed on the PCB board, and use a placemen...

Embodiment 3

[0050] Embodiment three: a kind of PCB board surface mount technology, comprises the following steps:

[0051] a. PCB board surface cleaning: Before the PCB board is mounted, the impurities and dust on the PCB board surface need to be cleaned. When cleaning, the PCB board is vibrated by ultrasonic waves, and the impurities and dust on the PCB board are shaken off the PCB board. , and then blow air to the PCB board, and remove the dust and impurities on the PCB board that have been shaken by the wind;

[0052] b. Printing solder paste: face the front of the PCB board, and print the solder paste on the PCB board where components need to be installed through a solder paste printing machine; when printing solder paste, it is necessary to ensure that the PCB board is in a horizontal position to prevent the position of the printed solder paste Deviation occurs;

[0053] c. Front component mounting: Mount the components that need to be installed on the PCB board, and use a placem...

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PUM

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Abstract

The invention discloses a surface mounting process for a PCB and relates to the technical field of PCB machining to solve the problem that the solder paste splashes because of insufficient solvent volatilization. The surface mounting process includes the following steps of: a, printing the solder paste; b, mounting components on a front surface; c, performing soldering in a reflow furnace; d, inverting the PCB; e, printing the solder paste; f, mounting components on a rear surface; g, performing soldering in the reflow furnace; and h, performing visual inspection. By applying ultrasonic wavesto a workpiece to be soldered during preheating, the workpiece to be soldered is oscillated, so that the solvent and moisture in the solder paste can be volatilized quickly from the solder paste, thereby reducing the subsequent solder paste splashing problem.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, more specifically, it relates to a PCB board surface mounting process. Background technique [0002] When surface mounting the PCB, most of the components are soldered on the surface of the PCB by reflow soldering; when soldering, most of the solder is pre-coated on the surface of the PCB, and then the components are placed on the PCB. Finally, send the PCB board with the components into the reflow oven for reflow soldering. [0003] Most of the solder paste contains rosin, active agent, viscosity improver and solvent. The function of the solvent is mainly to serve as the carrier of rosin and improve the storage time of the solder paste. In the reflow soldering process, the workpiece coated with solder paste needs to be The reflow soldering furnace passes through the preheating zone, heat preservation zone, reflow soldering zone and cooling zone in turn. The existing preheating zone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K3/3494H05K2203/1572
Inventor 王启胜赵林森刘德荣宋日新夏明明
Owner 深圳市英创立电子有限公司