A kind of anti-softening copper alloy and its preparation method and application

A copper alloy, anti-softening technology, applied in the direction of metal/alloy conductors, conductors, conductive materials, etc., can solve problems such as unsatisfactory, achieve excellent high-temperature softening performance, and improve high-temperature softening performance.

Active Publication Date: 2021-08-31
宁波博威新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, these existing copper alloy materials cannot meet the requirements of electronic and electrical components that tend to be miniaturized, environmentally friendly and economical to a certain extent, and a copper alloy material that meets the design requirements and has an advantage in cost of great significance

Method used

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  • A kind of anti-softening copper alloy and its preparation method and application

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Embodiment Construction

[0036] The present invention is described in further detail below with reference to the examples.

[0037] According to the composition of Table 1, the copper alloy shown in Table 1 was fuse at 1150 ° C, and a range of spots having a specification of 170 mm × 320 mm was produced. After holding the above ingot 800 ° C for 5 hours, hot rolling has a thickness of 16.5 mm, and after the hot rolling is completed, then the wire is cooled; then the milling surface makes the thickness of 15 mm, and then the thickness of 2 mm by cold rolling The board is heated to 440 ° C, then heat the plate after heat rolling, and the first time is performed; the timing is subjected to a second cold rolling, cold rolled to 0.4 mm, then thermally warmed at 400 ° C for 8 h The second aging treatment; finally cold rolling, rolling the target plate thickness 0.3 mm; after cooling, the temperature is maintained at 210 ° C for 4 hours to perform low temperature annealing to obtain a strip sample.

[0038] For ...

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Abstract

The invention discloses a softening-resistant copper alloy, which is composed of: 5.01-15.0wt% Zn, 0.1-2.0wt% Sn, 0.01-2.0wt% Ni, 0.01-1.0wt% Si, 0.001 ~ 1.5wt% Cr, the balance is Cu and unavoidable impurities. The present invention uses Cu-Zn-Sn as the matrix, adds Ni, Si, Cr and other elements, and combines solid solution strengthening and aging strengthening to obtain a yield strength ≥ 550 MPa, electrical conductivity ≥ 30% IACS, excellent bending performance and Copper alloy materials with high temperature resistance and softening temperature ≥ 450°C can meet the needs of the continuously developing electronic and electrical industries for alloy materials. The invention can solve various waste utilization problems, including tin-plated waste such as tin-phosphor bronze, copper-nickel-silicon alloy, brass, etc., which is beneficial to reduce environmental burden, reduce alloy preparation cost, and promote recycling of waste.

Description

Technical field [0001] The present invention relates to a copper alloy and its preparation technical field, particularly relates to a copper alloy and its preparation method and application of the softening-resistant. Background technique [0002] In recent years, with the development of electronics industry, various electronic devices to miniaturization, thinning and weight reduction, weight reduction, and wherein the device is used to promote a highly integrated compact, lightweight electronic component, high performance . At the same time, but also the performance of structural components of a higher requirement, to meet the strength requirements of the prepared parts, electrical conductivity, bending, and other performance requirements of the material, more importantly, with the miniaturization of electronic components and centralized, with the more heat problem can not be ignored, thus improving resistance to softening for the future development of electronic devices is impo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/04C22C1/02C22F1/08H01B1/02
CPCC22C1/02C22C9/04C22F1/08H01B1/026
Inventor 周耀华黄强李建刚赵红彬廖学华杨朝勇杨泰胜
Owner 宁波博威新材料有限公司
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