Wafer level packaging structure and packaging method of floodlight module

Abstract

The invention provides a wafer level packaging structure and a packaging method of a floodlight module. The wafer level packaging structure comprises a structure substrate, a functional chip, a spacerand an optical component; the functional chip is arranged at the surface of the substrate, the surface of the functional chip is electrically connected with the surface of the substrate through a metal wire; the substrate at the periphery of the functional chip is provided with the spacer, and the upper end of the spacer is higher than the functional chip; the optical component is arranged at theupper portion of the functional chip, two ends of the optical component are respectively connected with the top end of the spacer on the periphery of the functional chip, the optical component and the spacer jointly form a cavity structure, and the functional chip is located at the lower portion of the cavity structure. The optical component is formed by adopting a photoetching machine for imprinting, the alignment precision of the optical component with the substrate is high, and the finished product yield is high; the floodlight module adopts a wafer-level process, the optical component andthe substrate are pressed together by the wafer-level process, and then the optical component and the substrate are cut into single modules, so that the floodlight module has the characteristics of asmall size, a low height, good consistency and the like.

Description

technical field [0001] The invention relates to the field of photoelectric modules, in particular to a wafer-level packaging structure and packaging method of a floodlighting module. Background technique [0002] With the maturity of TOF (time of flight) and structured light 3D sensing technology, and the rapid development of the 3D camera industry, the ordinary floodlight module is far from meeting the market demand. For example, the camera module and the floodlight module work together. It has been widely used in 3D reconstruction, face recognition and other fields, but limited by the manufacturing process of existing module production, there is still room for improvement in product consistency and alignment accuracy. [0003] Traditional optical device processing technology does not have high requirements on the volume of the device, and the size of the device is usually large, which can no longer meet the needs of the miniaturization and miniaturization of products in th...

AI Technical Summary

Problems solved by technology

[0002] With the maturity of TOF (time of flight) and structured light 3D sensing technology, and the rapid development of the 3D camera industry, the ordinary floodlight module is far from meeting the market demand. For example, the camera module and the floodlight module work together. It has been widely used in 3D reconstruction, face recognition and other fields, but limited by the manufacturing process of existing module production, there is still room for improvement in product consistency and alignment accuracy.

[0003] The processing technology of traditional optical devices does not have high requirements on the volume of the device, and the size of the device is usually large, which can no longer meet the needs of miniaturization and miniaturization of products in the electronics industry.

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