Laser machining method and system for a wafer

Abstract

The invention relates to the field of wafer machining, in particular to a laser machining method and system for a wafer. A wafer cutting track is preset. The laser machining method includes the stepsthat a laser is incident into the wafer to conduct modification machining from the upper surface of the wafer along the cutting track, and at least one modification layer is formed; then cutting-up operation is conducted on the upper surface of the wafer along the cutting track through the laser, and a crack extending downwards from the upper surface is generated; and piece splitting operation isconducted on the wafer, and the wafer is separated in to multiple grains. The laser machining method and system for the wafer are designed so that the problem of obvious edge breakage or even grain damage can be prevented in the piece separation process, and the piece separation yield and efficiency are improved under the condition that a cutting way is narrower or the function area of the cuttingway is plated with a film layer. Meanwhile, even if in the condition that the cutting way is not narrower or the film layer is not plated on the cutting way function area, the wafer piece separationyield and efficiency can still be improved in the scheme.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a laser processing method and system for wafers. Background technique [0002] In the manufacturing process of semiconductor devices, on the surface of substrates such as silicon (Si) and silicon carbide (SiC), functional layers made of laminated insulating films and functional films are formed along the dicing lines (segmentation lines) arranged in a grid pattern. The area with optical devices is divided, and the wafer is cut to divide the devices of semiconductor wafers such as IC (Integrated Circuit) and LSI (Large-Scale Integration) into a matrix, thereby manufacturing individual semiconductor chips. [0003] In current manufacturing, wafer dicing generally uses three methods: [0004] 1. One is traditional mechanical cutting. Mechanical dicing mainly uses the mechanical stress of diamonds to grind wafers. There are problems such as mechanical deformation, stress concentrati...

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Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a laser processing method and system for wafers to solve the problem of obvious chipping or even damage to crystal grains during the process of wafer slicing, especially for the above-mentioned defects of the prior art. Wafers with narrower dicing lanes or film-coated dicing lane functional areas solve the problems of wafer slicing yield and low efficiency

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