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Processing technology of blister package

A technology of blister packaging and processing technology, applied in the field of product packaging, can solve problems such as cumbersome operation, damage, and poor corrosion resistance, and achieve the effects of improving corrosion resistance and fire resistance, prolonging service life, and improving product quality

Inactive Publication Date: 2019-09-10
南京德荣包装制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the processing technology of most blister packaging on the market is relatively simple, the operation is also very cumbersome, and the quality cannot be guaranteed, and the pass rate is not high
Moreover, the corrosion resistance of blister products currently on the market is poor, and they are often easily damaged by corrosion.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A kind of processing technology of blister packaging provided by this embodiment comprises the following steps:

[0027] (1) Ingredients: The mass percentage of each component in the blister packaging is: 0.36% phenolic resin, 2.34% polyethylene, 3.15% polyvinyl chloride, 2.16% polystyrene, 0.85% polycarbonate, 2.37% acrylic acid, magnesium oxide 0.34%, zinc oxide 0.13%, aluminum oxide 0.55%, styrene-butadiene rubber 0.12%, antimony trioxide 0.08%, and the balance is polypropylene; raw materials for blister packaging are formulated according to the mass percentage of each component in the blister packaging ;

[0028] (2) Pulverization: use a pulverizer to pulverize the raw materials of the above-mentioned blister packaging separately and then mix them;

[0029] (3) Drying: Dry the mixed raw materials at 65°C for 7 hours;

[0030] (4) Add the dried raw materials into the extruder, and carry out the extrusion molding process to obtain the raw material sheet;

[0031] (...

Embodiment 2

[0037] A kind of processing technology of blister packaging provided by this embodiment comprises the following steps:

[0038] (1) Ingredients: The mass percentage of each component in the blister packaging is: 0.51% phenolic resin, 3.43% polyethylene, 3.32% polyvinyl chloride, 2.36% polystyrene, 1.12% polycarbonate, 3.22% acrylic acid, magnesium oxide 0.45%, zinc oxide 0.16%, aluminum oxide 0.67%, styrene-butadiene rubber 0.26%, antimony trioxide 0.11%, and the balance is polypropylene; raw materials for blister packaging are formulated according to the mass percentage of each component in the blister packaging ;

[0039] (2) Pulverization: use a pulverizer to pulverize the raw materials of the above-mentioned blister packaging separately and then mix them;

[0040] (3) Drying: Dry the mixed raw materials at 65°C for 7 hours;

[0041] (4) Add the dried raw materials into the extruder, and carry out the extrusion molding process to obtain the raw material sheet;

[0042] (...

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PUM

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Abstract

The invention discloses a processing technology of a blister package, and belongs to the technical field of product packages. The processing technology of the blister package comprises the following steps: (1) mixing materials; (2) crushing; (3) drying; (4) adding dried raw materials to an extruder, and carrying out an extruding forming technology to obtain a raw material plate; (5) selecting a blister die with proper size and the raw material plate; (6) modeling; (7) releasing the die; (8) spraying a pure aluminum coating being 100-400 microns in thickness on the surface of the blister package; and (9) inspecting, namely, selecting inferior-quality products from the blister package, and packing the finished product and warehousing. According to the technology, the components of the blister package include phenolic resin, polyethylene, polyvinyl chloride, polystyrene, polycarbonate, acrylic acid, magnesium oxide, zinc oxide, aluminum oxide, butadiene styrene rubber, antimonous oxide and polypropylene; and the components are mixed to realize high thermoplastic performance of a packing box.

Description

technical field [0001] The invention relates to a processing technology of blister packaging, which belongs to the technical field of product packaging. Background technique [0002] Blister molding is a kind of plastic processing technology. The main principle is to heat and soften the flat hard plastic sheet, then absorb it on the surface of the mold by vacuum, and form it after cooling. It is widely used in plastic packaging, lighting, advertising, decoration and other industries. Blister molding, also known as vacuum forming, is one of the thermoforming methods of thermoplastics, that is, the sheet or plate material is clamped on the frame of the vacuum forming machine, heated and softened, and then vacuumed through the air channel at the edge of the mold. Adsorbed on the mold, after a short period of cooling, the molded plastic products are obtained. [0003] However, most of the blister packaging currently on the market has a relatively simple processing technology, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C48/07B29C51/10
CPCB29C48/0017B29C48/07B29C51/10
Inventor 杨淙茗
Owner 南京德荣包装制品有限公司