Production process of internal insulation plastic package device

Abstract

The invention discloses a production process of an integral insulation plastic package device. With the design of holes formed in a copper-coated ceramic sheet, the integral height is increased, the area of a copper-coated region is ensured to the maximum extent, and the loading effective region can be substantially expanded; a chip combination at the maximum size of 6,090 micrometers by 6,330 micrometers by 3,000 micrometers by 5,000 micrometers can be packaged, the combination of various types of chips in a paired way can be accommodated, the demand of a large amount of products in the market can be satisfied, so that the economic benefit is ensured; the total thickness of the copper-coated ceramic sheet is 1.24 + / -0.05 millimeters, and a chip groove can be enabled to be filled with enough amount of plastic package body during package of a dual-tabletop product; the product can smooth pass through 3,000-3,500VRMS insulation voltage, and the product reliability is ensured; with a headand leg integrated lead framework, the consistency of the framework structure and the size can be ensured; and compared with a production mode of a traditional cooling piece rack, the insulation ceramic sheet and a lead scaffold, the assembly of the integrated framework and the copper-coated ceramic sheet is simpler, and the production efficiency can be substantially improved.

Description

technical field [0001] The invention relates to a production process of a plastic-encapsulated device, in particular to a production process of an internal insulation plastic-encapsulated device. Background technique [0002] In the current field of electronic component packaging technology, the common internal insulation plastic packaging needs to meet certain insulation requirements, and its structure and composition generally include the following points: [0003] (1) Use insulating ceramic sheets. Generally, ceramic sheets of 0.5±0.05mm are used. In the production process, in order to cooperate with the ceramic sheet, a head-to-foot discrete frame structure is usually used, but there are a series of problems such as cumbersome production steps, reduced production efficiency, and unstable sintering effect due to the discrete frame structure. [0004] There are also certain risks in the internal insulating plastic packaging device prepared by using insulating ceramic she...

AI Technical Summary

Problems solved by technology

The thickness of the ceramic sheet is 0.5 ±0.05 mm, when packaging a double-mesa chip, the filling height of the plastic package under the chip groove is about 635 μm, and the filling amount of the plastic package is small, which may cause the product to fail to pass 3000-3500V RMS left and right insulation voltage;

[0005] (2) Traditional insulating ceramic sheets or copper-clad ceramic sheets are affected by the frame, and the maximum size is generally limited to be flush with the waterproof groove of the frame

And because of its special structure, the consistency of frame size cannot be guaranteed

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