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Thermal interface material, interface thermal coupling method, and production method for thermal interface material

A manufacturing method, thermal bonding technology, applied in heat exchange materials, chemical instruments and methods, cooling/ventilation/heating transformation, etc.

Pending Publication Date: 2019-09-17
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is known that in such a system with only a soft material, the soft material decomposes or diffuses due to localized heat concentration (called bleeding), and there is a problem that it is difficult to use it as a TIM.

Method used

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  • Thermal interface material, interface thermal coupling method, and production method for thermal interface material
  • Thermal interface material, interface thermal coupling method, and production method for thermal interface material
  • Thermal interface material, interface thermal coupling method, and production method for thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0094] Six types (A to F) of graphite films were produced by the above method. The HTT, thickness, thermal conductivity, and density at the time of fabrication are as follows.

[0095] (A)HTT: 2900°C, thickness 14.6μm, thermal conductivity in film direction: 1810W / mK, density 2.0g / cm 3

[0096] (B)HTT: 2900°C, thickness: 7.3μm, thermal conductivity in the film direction: 1780W / mK, density 2.0g / cm 3

[0097] (C)HTT: 2900°C, thickness: 2.7μm, thermal conductivity in the film direction: 1700W / mK, density 2.0g / cm 3

[0098] (D)HTT: 2900°C, thickness: 1.0μm, thermal conductivity in the film direction: 1700W / mK, density 2.0g / cm 3

[0099] (E)HTT: 2900°C, thickness: 0.3μm, thermal conductivity in the film direction: 1610W / mK, density 1.9g / cm 3

[0100] (F)HTT: 2900℃, Thickness: 0.1μm, Thermal conductivity in film direction: 1620W / mK, Density: 1.9g / cm 3

[0101] A flexible acrylic layer (thickness 1 μm) was formed on both surfaces of the aforementioned (A) to (F), and used a...

Embodiment 8~10

[0114] Three types of graphite thin films were prepared by changing the maximum treatment temperature (HTT) of (B) used in the examples. Flexible layers (thickness: 10 μm) were formed on both surfaces using an acrylic polymer as a flexible material, and the thermal resistance characteristics were measured by the same method as in Examples 1 to 7. The results are shown in Table 3.

[0115] (B-2) HTT: 2700°C, Thickness: 7.3μm, Thermal conductivity in film direction: 1280W / mK, Density: 2.0g / cm 3

[0116] (B-3)HTT: 2600°C, thickness: 7.3μm, thermal conductivity in the film direction: 1080W / mK, density 1.9g / cm 3

[0117] (B-4)HTT: 2400°C, Thickness: 7.3μm, Thermal conductivity in film direction: 580W / mK, Density: 1.7g / cm 3

[0118] [table 3]

[0119]

[0120] From this result, it can be seen that the thermal conductivity in the plane direction of the graphite film has a great influence on the TIM characteristics. In order to achieve low thermal resistance characteristics, ...

Embodiment 11~16

[0122] Using the graphite thin film (E), six types of TIMs in which the type and thickness of the flexible layer were changed were fabricated. Table 4 shows the results of measuring the thermal resistance characteristics by the same method as in the above-mentioned examples. From this result, it can be seen that the type of the flexible material has little influence on the thermal resistance characteristics, and the weight ratio of the flexible material to the graphite film (flexible material / graphite film) is preferably in the range of 0.08 to 25 (preferably 1 to 20).

[0123] [Table 4]

[0124]

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PUM

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Abstract

The present invention achieves: a graphite-based thermal interface material that exhibits excellent thermal resistance properties even when used between members having uneven surfaces; and a production method for such a thermal interface material. This thermal interface material comprises a flexible or fluid substance (A) and a graphite film (B), wherein the graphite film has a thickness falling within the range of 100 nm to 15 [mu]m, a density falling within the range of 1.20-2.26 g / cm<3>, and a thermal conductivity in the film surface direction of at least 500 W / mK, and the weight ratio (A / B) between (A) and (B) falls within the range of 0.08-25.

Description

technical field [0001] The present invention relates to an interlayer thermally bonded member for rapidly transferring heat from a heat source to a cooling / heat radiation portion, an interlayer thermally bonded method, and a method for manufacturing the interlayer thermally bonded member. Background technique [0002] In recent years, the problem of heat in electronic equipment, LED (Light Emitting Diode) lighting, etc. has become a major issue to be solved. For heat release / cooling, there are methods using heat conduction, heat radiation, and heat convection. In order to effectively dissipate / cool the heat of the heat source, it is necessary to combine these heat dissipating / cooling methods to effectively transfer the heat of the heat generating part to the heat dissipating / cooling parts such as circuit boards, heat sinks, radiators, etc. The thermal resistance between the heat generating part and the heat releasing / cooling part becomes particularly important. [0003] Ev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36C01B32/205C09J7/20C09J133/00C09J163/00C09J183/04C09J201/00H01L23/373H05K7/20
CPCC01B32/205C09J133/00C09J163/00H01L23/373H01L23/3737C01P2006/10C01P2006/40C09D163/00C01P2006/32C09K5/048C09K5/063H01L33/641
Inventor 村上睦明多多见笃立花正满
Owner KANEKA CORP
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