Wafer cutting machine and wafer edge cutting method

Abstract

The invention relates to a wafer cutting machine and a wafer edge cutting method, wherein the wafer cutting machine includes: cutting pieces of at least two sizes for cutting wafers, and the cutting width of each cutting piece is Each is different; the rotating head includes a first surface for facing the wafer to be cut, all the cutting blades are detachably mounted on the first surface, and the rotating head can rotate around a The linear rotation of the surface changes the cutting blade for cutting the wafer. The above wafer cutting machine and wafer edge cutting method have at least two cutting blades, which can complete various wafer edge cutting requirements in the same machine, meet the diverse needs of wafer manufacturing processes, and improve machine performance. And it can detect the cutting edge of the wafer in time during cutting, and only take out the edge of the cut wafer after it meets the requirements, so it will not affect the subsequent wafer manufacturing process.

Description

technical field [0001] The invention relates to the field of wafer processing and manufacturing, in particular to a wafer cutting machine and a wafer edge cutting method. Background technique [0002] With the advent of the 3D chip era, edge trimming (edge ​​trimming) technology is also increasingly important. [0003] In the existing technology, it is necessary to use technical means such as grinding, polishing, etching, etc. to thin the wafer to a thickness of several microns, and during the thinning process, it is easy to break the wafer and reduce the yield of the wafer. A large part of this problem is caused by poor bonding between the outer edge of the wafer and the vicinity of the circumference and the carrier substrate. Due to poor bonding between the vicinity of the above-mentioned edge and the carrier substrate, the wafer cannot receive sufficient support from the carrier substrate to resist the stress from the grinding or transfer process, causing cracks in the p...

AI Technical Summary

Problems solved by technology

[0005] However, the existing commercial wafer cutting machine has a single function and only includes a wafer edge trimming unit and a wafer cleaning unit

However, the design and process conditions of the products are different, so that the existing wafer cutting machines cannot meet the needs of product diversification.

For example, when the product design and process conditions are different, different wafers are required to have different edge cutting widths, but the current commercial wafer cutting machine can only hang a single-size cutting chip (Dicing blade), when switching the width of edge cutting, it may be necessary to replace the machine, or replace the cutting blades hanging on the machine, the performance of the machine is not good

[0006] Moreover, the yield rate of wafers processed by wafer cutting machines in the prior art is low, which greatly affects the subsequent wafer processing flow.

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