Preparation methods of bisphenol A modified phenolic resin and modified phenolic resin molding material

A technology of phenolic resin and molding compound, applied in the field of polymer synthesis and modification, can solve the problem of oxidative discoloration of phenolic molding compound, and achieve the effect of good oxidation resistance

Inactive Publication Date: 2019-10-18
沙县宏盛塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The problem of oxidation and discoloration of phenolic molding compound is still a problem that needs to be solved and improved

Method used

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  • Preparation methods of bisphenol A modified phenolic resin and modified phenolic resin molding material

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preparation example Construction

[0024] A method for preparing bisphenol A modified phenolic resin according to an embodiment of the present invention includes the following steps:

[0025] 1) Phenol and acid are added to the reaction kettle, stirred, and heated to 80-90°C to obtain the reaction liquid;

[0026] 2) Add formaldehyde gradually to the reaction solution obtained in step 1), and control the reaction temperature to be 85-95°C, react for 0.5-2h to obtain the reaction solution;

[0027] 3) Gradually add bisphenol A to the reaction solution obtained in step 2), raise the temperature to 90-120°C, and react for 0.5-2h;

[0028] 4) Gradually add melamine to the reaction solution obtained in step 3), and react for 1-3h;

[0029] 5) Dehydration under reduced pressure to obtain modified phenolic resin.

[0030] Preferably, in the above-mentioned preparation method of bisphenol A modified phenolic resin, the formaldehyde is an aqueous formaldehyde solution, and the molar ratio of formaldehyde to phenol is 0.6-0.95.

[0...

Embodiment 1

[0043] A preparation method of bisphenol A modified phenolic resin, including:

[0044] 1) Measure 100g of phenol and 3g of oxalic acid into the reactor, stir, and raise the temperature to 85°C;

[0045] 2) Add 55 g of 37% formaldehyde aqueous solution gradually to the reaction solution obtained in step 1), and control the reaction temperature to 90°C, and react for 1 hour;

[0046] 3) Gradually add 20g of bisphenol A to the reaction solution obtained in step 2), raise the temperature to 110°C, and react for 1.5 hours;

[0047] 4) Gradually add 10g of melamine to the reaction solution obtained in step 3), and react for 2h;

[0048] 5) Dehydration under reduced pressure to obtain modified phenolic resin.

[0049] A preparation method of modified phenolic resin molding compound, including:

[0050] (1) 30 parts of bisphenol A modified phenolic resin, 25 parts of carbon fiber, 15 parts of calcium carbonate, 1 part of titanium blue, 20 parts of curing agent, 5 parts of stearic acid, 1,3,5-tri...

Embodiment 2

[0053] A preparation method of bisphenol A modified phenolic resin, including:

[0054] 1) Measure 100g of phenol and 3g of acetic acid into the reactor, stir, and raise the temperature to 90°C;

[0055] 2) Add 60 g of 37% formaldehyde aqueous solution gradually to the reaction solution obtained in step 1), and control the reaction temperature to 95° C., and react for 1 hour;

[0056] 3) Gradually add 30g of bisphenol A to the reaction solution obtained in step 2), raise the temperature to 110°C, and react for 1.5h;

[0057] 4) Gradually add 20 g of melamine to the reaction solution obtained in step 3), and react for 2 hours;

[0058] 5) Dehydration under reduced pressure to obtain modified phenolic resin.

[0059] A preparation method of modified phenolic resin molding compound, including:

[0060] (1) 40 parts of bisphenol A modified phenolic resin, 30 parts of carbon fiber, 10 parts of talc, 2 parts of titanium blue, 10 parts of curing agent, 3 parts of stearic acid, 1,3,5-trimethyl A...

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Abstract

The invention relates to the technical fields of synthesis and modification of polymers and specifically relates to preparation methods of bisphenol A modified phenolic resin and a modified phenolic resin molding material. The preparation method of the bisphenol A modified phenolic resin comprises the following steps: 1) adding phenol and acid into a reactor, and carrying out stirring to obtain areaction solution; 2) dropwise adding formaldehyde into the reaction solution obtained in step 1) step by step to obtain a reaction solution; 3) adding bisphenol A into the reaction solution obtainedin step 2) step by step to obtain a reaction solution; 4) adding melamine into the reaction solution obtained in step 3) step by step, and carrying out a reaction for 1-3 h; and 5) carrying out reduced-pressure dehydration to obtain the modified phenolic resin. The preparation methods have the beneficial effects that according to the preparation method provided by the invention, the phenolic resinis modified by adopting the bisphenol A and the melamine, the bisphenol A and the melamine are added within a specific time interval, so that the prepared phenolic resin and the phenolic resin molding material have good oxidation resistance, and a phenolic molding plastic product with a light-color appearance can be prepared by adopting the modified phenolic resin.

Description

Technical field [0001] The invention relates to the technical field of polymer synthesis and modification, in particular to a method for preparing a bisphenol A modified phenolic resin and a modified phenolic resin molding compound. Background technique [0002] Phenolic molding compound is a composite material prepared by mixing phenolic resin with fillers and various additives through melting pot. It has the advantages of high temperature resistance, flame retardant, high strength, good processing performance, and resistance to deformation. It is widely used Home appliance parts, such as handles, bases, covers, etc., as well as electronic appliances and other fields. The base phenolic resin for the preparation of phenolic molding compounds is mainly obtained by polycondensation of phenol and formaldehyde, including two categories of thermoplasticity and thermosetting. [0003] In order to further improve the properties of molding compounds, such as electrical properties, mechani...

Claims

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Application Information

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IPC IPC(8): C08G14/10C08L61/34C08K13/04C08K7/06C08K3/26C08K5/09C08K3/34
CPCC08G14/10C08K13/04C08K7/06C08K3/26C08K5/09C08K3/34C08K2003/265C08L2201/08C08L61/34
Inventor 黄世俊郭煌民李金凤王鑫朱光明艾生儿罗建峰
Owner 沙县宏盛塑料有限公司
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