Preparation method of LED filament and LED filament

A technology of LED filament and LED chip, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems that affect the service life of LED filament, the quality requirements of wire arc are relatively strict, and the metal wire is easy to break. Fracture, uniform heating effect

Inactive Publication Date: 2019-11-05
厦门多彩光电子科技有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are many LED chips used in LED filaments, and they are usually connected in series. A short circuit or open circuit of a metal wire will cause the entire LED filament to be scrapped, and the quality requirements for the arc are relatively strict.
Especially in the process of use, the L

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of LED filament and LED filament
  • Preparation method of LED filament and LED filament
  • Preparation method of LED filament and LED filament

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] To further illustrate the various embodiments, the present invention is provided with accompanying drawings. These drawings are a part of the disclosure of the present invention, which are mainly used to illustrate the embodiments, and can be combined with related descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should understand other possible implementations and advantages of the present invention. Components in the figures are not drawn to scale, and similar component symbols are generally used to denote similar components.

[0031] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0032] refer to figure 1 As shown, the preparation method of a kind of LED filament provided in this embodiment comprises the following steps:

[0033] A1, provide a strip-shaped filament substrate and multiple LED ch...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a preparation method of an LED filament and an LED filament. The preparation method comprises the steps of A1, providing a strip-shaped filament substrate and a plurality of LEDchips, wherein the plurality of LED chips extend along the length direction of the filament substrate in a left-right staggered mode and are die-bonded on the filament substrate; A2, welding a metalwire between the adjacent LED chips to form electric connection, wherein the metal wire has radians on a horizontal projection plane parallel to the surface of the filament substrate and a vertical projection plane perpendicular to the surface of the filament substrate; and A3, coating a packaging adhesive, wherein the packaging adhesive coats the LED chips and the metal wires. The stability of the LED filament can be effectively enhanced, and the service life of the LED filament is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor lighting, in particular to a method for preparing an LED filament and an LED filament prepared by the method. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. Compared with ordinary lamps (incandescent lamps, etc.), the emergence of LED lights has the advantages of energy saving, long life, good applicability, short response time, and environmental protection. LED lights can be divided into different structures according to different structures: bulb lamps, spotlights, Day-off lights, filament lamps, etc. [0003] Filament-type LED lamps, referred to as filament lamps, take the appearance of traditional light bulbs and use long, flat, disc-shaped LED light-emitting modules (ie, LED filaments) as light sources, which not only ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L25/075H01L33/48H01L33/58H01L33/62
CPCH01L25/0753H01L33/483H01L33/58H01L33/62H01L2933/0033H01L2933/0058H01L2933/0066
Inventor 温小斌郑剑飞王明苏水源
Owner 厦门多彩光电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap