Beam combiner packaging structure of high-power laser system

Abstract

The invention discloses a beam combiner packaging structure of a high-power laser system, and the structure comprises an optical fiber beam combiner, a metal packaging bottom plate, a metal packagingcover plate and a packaging sleeve. An input optical fiber groove, a rectangular groove and an output optical fiber groove are formed in the bottom plate, and the input optical fiber groove comprisesa plurality of separated small grooves for respectively placing single input optical fibers; the side surface of the metal bottom plate comprises at least two groups of cooling water inlets and outlets; a gap between the packaging sleeve and the rectangular groove is filled with a heat conduction material. According to the invention, a high-temperature-resistant and high-thermal-conductivity heat-conducting sealant material and a thermal layer filling heat-conducting material are selected, and the high-thermal-conductivity metal is selected as the packaging box body, so that the heat dissipation efficiency of the packaging structure can be remarkably improved, the problem of poor long-term working stability of the high-power laser system beam combiner is solved, and the reliability and stability of the beam combiner are ensured to the greatest extent.

Description

technical field [0001] The invention relates to the field of fiber laser technology, in particular to a package structure of a beam combiner for a high-power laser system. Background technique [0002] High-power fiber laser systems have many advantages such as high conversion efficiency, high power, high reliability, long life, small size and low cost, and are currently widely used in industrial processing, biomedical, national defense and military fields. As the output power of the fiber laser system increases, the beam combining system becomes more and more complex, which poses a great challenge to the design and adjustment of the system, and also puts forward higher requirements for the skill level of the adjustment personnel. With the continuous increase of optical power, the current injected into the doped region is also continuously increased, resulting in the continuous increase of heat dissipation power in the doped region. If the heat generated during the operation...

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Problems solved by technology

[0006] In view of the problems existing in the above-mentioned prior art, the object of the present invention is to provide a beam combiner packaging structure for a high-power laser system, by using a heat-conducting sealant material with high temperature resistance and high thermal conductivity and a thermal layer filled with a thermally conductive material, and selecting a high thermally conductive The metal is used as the packaging box to solve the problems of poor heat dissipation and poor long-term stability of the existing beam combiner packaging, so as to ensure the reliability of the beam combiner to the greatest extent.

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