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Moisture-curing polyurethane hot-melt resin composition and laminate

Active Publication Date: 2021-11-23
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned moisture-permeable polyurethane has high hydrophilic polyethylene oxide glycol as its main component, so it has excellent moisture permeability, but has a problem of low peel strength

Method used

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  • Moisture-curing polyurethane hot-melt resin composition and laminate
  • Moisture-curing polyurethane hot-melt resin composition and laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] In a four-necked flask equipped with a thermometer, a stirrer, an inert gas inlet, and a reflux cooler, 100 parts by mass of polypropylene glycol (number-average molecular weight: 700, hereinafter referred to as "PPG700") was added, mixed, and heated at 70°C. Dehydration was performed by heating under reduced pressure until the water content in the flask became 0.05% by mass or less.

[0075] Next, the inside of the flask was cooled to 90° C., 65.2 parts by mass of 4,4′-diphenylmethane diisocyanate (hereinafter abbreviated as “MDI”) melted at 70° C. It was reacted for about 3 hours until the isocyanate group content became constant, thereby obtaining a hot-melt urethane prepolymer of NCO%: 5.9% by mass.

[0076] Next, after melting the obtained urethane prepolymer at 80° C. for 1 hour, a thermoplastic polyurethane resin film (hereinafter abbreviated as “TPU”) was coated using a gravure coater (speed: gm / min). The coating amount can reach 15g / m 2 coated in a manner. N...

Embodiment 2～5

[0078] [Examples 2-5, Comparative Examples 1-4]

[0079] Except for changing the types and compounding amounts of the raw materials used in the manufacture of the urethane prepolymer (i) as shown in Tables 1 and 2, the moisture-curable polyurethane hot-melt was obtained in the same manner as in Example 1. Resin composition and laminate.

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Abstract

The present invention provides a moisture-curable polyurethane hot-melt resin composition, characterized in that the melt viscosity at 120°C is in the range of 160-800mPa·s, and the melt viscosity at 80°C is in the range of 850-10000mPa·s. Also, the present invention provides a laminate characterized in that a layer of a cured product of the above-mentioned moisture-curable polyurethane hot-melt resin composition, and a resin film or a fiber substrate are laminated in this order. The above-mentioned moisture-curing polyurethane hot-melt resin composition is preferably a composition containing a urethane prepolymer (i), and the urethane prepolymer (i) is polyol (a) and polyisocyanate (b) ) and having an isocyanate group, the above-mentioned polyol (a) is preferably a specific one.

Description

technical field [0001] The present invention relates to a moisture-curable polyurethane hot-melt resin composition and a laminate having a cured product layer thereof. Background technique [0002] Mountaineering clothing, sportswear, and the like are required to have excellent moisture permeability, water resistance, etc. in addition to ease of movement and lightness when worn in general. Among them, moisture permeability is an important characteristic from the viewpoint of suppressing discomfort caused by stuffiness caused by moisture generated in the body such as perspiration staying in clothing. [0003] As a moisture-permeable material having the above-mentioned moisture permeability, for example, a moisture-permeable polyurethane made of a polyol mainly composed of polyethylene glycol, a chain extender, and a polyisocyanate is disclosed (for example, refer to Patent Document 1). [0004] The above-mentioned moisture-permeable polyurethane has a high moisture-permeabil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/28B32B27/00C08G18/10C08G18/30C09J175/04C09J175/08
CPCB32B27/08B32B27/12B32B27/40C08G18/10C08G18/307C08G18/48C08G18/7671C08L75/08
Inventor 竹田伸吾藤原丰邦二宫淳
Owner DIC CORP