Low-temperature sintered nano silver paste and sealing method of sealing device

A technology of low-temperature sintering and nano-silver paste, which is applied in the manufacture of electric solid devices, semiconductor devices, and semiconductor/solid-state devices, etc., can solve the problems that the safety and environmental performance of sealed devices cannot be guaranteed, the application and promotion are restricted, and the human body and the environment are harmful. To achieve the effect of simplifying the extraction and sealing process, reducing the thermal impact, and ensuring the tempering performance

Inactive Publication Date: 2019-11-08
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional preparation method of sealing devices mainly uses resin and polymer glue for bonding, which is not resistant to high temperature, has poor stability, and is easy to age and crack
In the later stage, low-melting glass frit is used for sealing, but because the low-melting glass used in this process is mainly lead-based glass, which is harmful to the human body and the environment, from the perspective of environmental protection, lead-containing glass and solder limit its application and promotion , cannot guarantee the safety and environmental performance of the sealed device

Method used

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  • Low-temperature sintered nano silver paste and sealing method of sealing device
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  • Low-temperature sintered nano silver paste and sealing method of sealing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a low-temperature sintered nano silver paste and a sealing method for sealing devices, which specifically includes the following steps:

[0041] The self-made glass powder, 500nm spherical silver powder and mixed organic solvent are fully mixed according to a certain proportion, and the glass powder with a median diameter of about 2μm and the silver powder with a median diameter of about 500nm are spherical and The mixed organic vehicle is mixed in a ratio of 15:75:10, and the components contained in the mixed organic vehicle and their weight percentages are: α-terpineol 65%, ethyl cellulose 3%, ethyl acetate 15% , Ethylene glycol butyl ether 5%, diethylene glycol butyl ether acetate 3%, soybean lecithin 2% and antifoaming agent 7%, of which ethyl cellulose and soybean lecithin are dissolved in α-terpineol. It is prepared into a novel lead-free low-temperature sintered nano silver paste that can be printed on steel mesh or screen. The composition ...

Embodiment 2

[0049] This embodiment provides a low-temperature sintered nano silver paste and an efficient sealing method for sealing devices, which specifically includes the following steps:

[0050] The glass powder, 500nm spherical silver powder and mixed organic solvent are fully mixed according to a certain ratio to prepare a novel lead-free low-temperature sintered nano silver paste that can be printed on steel mesh or screen.

[0051] In terms of weight percentage, the glass powder with a median diameter of about 2μm and the silver powder with a median diameter of about 500nm are spherical in shape and mixed-type organic carriers are mixed in a mass ratio of 15:75:10, where the mixed-type organic carrier is mixed Contains α-terpineol 65%, ethyl cellulose 3%, ethyl acetate 15%, ethylene glycol butyl ether 5%, diethylene glycol butyl ether acetate 3%, soybean lecithin 2% and defoamer 7%, of which ethyl cellulose and soybean lecithin are respectively dissolved in α-terpineol. Wherein, the ...

Embodiment 3

[0057] On the basis of Example 1, the formulation of the low-temperature sintered nano-silver paste is different.

[0058] In terms of weight percentage, the glass powder with a median diameter of about 2μm and the silver powder with a median diameter of about 500nm are spherical in shape and mixed-type organic carriers are mixed in a mass ratio of 15:75:10, where the mixed-type organic carrier is mixed Contains α-terpineol 65%, ethyl cellulose 3%, ethyl acetate 15%, ethylene glycol butyl ether 5%, diethylene glycol butyl ether acetate 3%, soybean lecithin 2% and defoamer 7%, of which ethyl cellulose and soybean lecithin are respectively dissolved in α-terpineol. Wherein, the composition and mole percentage of the glass powder are: Bi 2 O 3 40%, H 3 BO 3 50%, ZnO 10%.

[0059] The steps and process parameters of the sealing method of the sealed device are the same as in Embodiment 1.

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Abstract

The invention provides a low-temperature sintered nano silver paste and a sealing method of a sealing device. The components of the low-temperature sintered nano silver paste comprise a glass powder,a silver powder and an organic solvent. The glass powder comprises, in mol percentages, 25% to 50% of Bi2O3, 40% to 60% of H3BO3, and 10% to 30% of ZnO. The low-temperature sintered nano silver pastesatisfies a low-temperature sintering requirement, is friendly to environment, and guarantees the intrinsic characteristics of a material at a sealing part, and the connection strength and the air impermeability of the sealing part. The nano silver paste is printed on the surface of cleaned glass, ceramic and kovar alloy by steel screen or silk screen, and can form a silver film with high bondingforce and a shear strength more than 40MPa on the surface of the cleaned glass, ceramic and kovar alloy after a binder discharging and low-temperature sintering treatment.

Description

Technical field [0001] The invention belongs to the technical field of device sealing, and in particular relates to a low-temperature sintered nano silver paste and a sealing method for sealing devices. Background technique [0002] The sealing device is an effective functional device that effectively isolates the air and protects the internal materials from oxidation and deliquesce corrosion. Among them, vacuum glass is one of the best energy-saving glass products today. It not only has good light transmission, but also has a vacuum environment of the sandwich It can hinder the contact heat transfer and convection heat transfer of the structure, has excellent heat preservation effect, and has good sound insulation performance. It can play the role of heat preservation and heat insulation, prevention of condensation, energy saving and consumption reduction, sound insulation and noise reduction. The current key development direction of energy-efficient glass. However, the method ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10H01L21/50C03C8/24
CPCC03C8/24H01L23/10H01L24/29H01L24/83H01L2224/29139H01L2224/29188H01L2224/83359
Inventor 李明雨孙钦李玉峰
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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