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Encapsulation adhesive and preparation method thereof, encapsulation body and preparation method thereof

A technology of encapsulation glue and encapsulation body, which is applied in the direction of adhesives, semiconductor devices, non-polymer organic compound adhesives, etc., can solve the problems of difficult preservation of quantum dots, slow photocuring rate, and failure of quantum dots, etc., to achieve improved photoinitiation High efficiency, high curing efficiency and fast curing speed

Active Publication Date: 2021-09-17
TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged for application to prolong their service life.
[0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue, and the initiator in the colloid will generate active free radicals through high temperature, thereby initiating polymerization reaction, but for quantum dots, high temperature is easy Quenching the quantum dots and making them invalid; the other is to encapsulate the quantum dots with light-cured encapsulation glue, and polymerize the colloid through light-curing. This method effectively avoids the quenching of quantum dots, but the existing optical The cured encapsulant has high energy requirements, and it needs to absorb a large amount of energy to cure the colloid, so the light curing rate is slow

Method used

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  • Encapsulation adhesive and preparation method thereof, encapsulation body and preparation method thereof
  • Encapsulation adhesive and preparation method thereof, encapsulation body and preparation method thereof
  • Encapsulation adhesive and preparation method thereof, encapsulation body and preparation method thereof

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preparation example Construction

[0071] According to another aspect of the present invention, there is provided a method for preparing the above encapsulation glue, comprising: uniformly mixing various raw materials to obtain the encapsulation glue.

[0072] The method has simple process and low preparation cost, and the obtained encapsulation glue can be cured by ultraviolet light without high temperature curing, and has the advantages of high curing efficiency, fast curing speed and good environmental protection.

[0073] According to another aspect of the present invention, a method for preparing a package is provided, comprising: uniformly mixing the above-mentioned encapsulant with a material to be packaged, then applying it to the surface of a substrate, and then curing it with ultraviolet light to obtain a package.

[0074] The preparation method of the package body adopts the above-mentioned package glue to package the package material, and adopts ultraviolet light to cure, which has the advantages of ...

Embodiment 1

[0096] An encapsulant, mainly prepared from the following raw materials in parts by mass: 40 parts of dipropylene glycol diacrylate, 30 parts of pentaerythritol triacrylate, 10 parts of NeoRad U-10-15T, 1 part of Omnirad 907 ultraviolet photoinitiator and benzene Ketone 1 part.

Embodiment 2

[0098] An encapsulant, mainly prepared from the following raw materials in parts by mass: 60 parts of dipropylene glycol diacrylate, 10 parts of pentaerythritol triacrylate, 50 parts of NeoRad U-10-15T, 15 parts of Omnirad 907 ultraviolet photoinitiator and benzene 8 servings of ketones.

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Abstract

The invention relates to the field of packaging materials, and specifically provides a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. The encapsulant is mainly prepared from the following raw materials in parts by mass: 40-60 parts of difunctional acrylate, 10-30 parts of trifunctional acrylate, 10-50 parts of acrylate prepolymer, ultraviolet photoinitiator 1‑15 parts and photosensitizer 1‑8 parts. The packaging adhesive has the advantages of high curing efficiency, fast curing speed, environmental protection and low cost, and does not require high temperature during curing, and will not quench the quantum dots.

Description

technical field [0001] The invention relates to the field of packaging materials, in particular to a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. Background technique [0002] Quantum dots are semiconductor nanostructures that bind excitons in three spatial directions. By applying a certain electric field or light pressure to quantum dots, they will emit light of a specific frequency, and have high photochemical performance and long fluorescence lifetime. , therefore, quantum dots have good application prospects in the fields of lighting and display. However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of usually only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged before application to prolong their service life. [0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J167/06H01L33/56
CPCC09J4/00C09J167/06H01L33/56
Inventor 高欣李春峰李冬洪建明
Owner TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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