Encapsulation adhesive and preparation method thereof, encapsulation body and preparation method thereof

A technology of encapsulation glue and encapsulation body, which is applied in the direction of adhesives, semiconductor devices, non-polymer organic compound adhesives, etc., can solve the problems of difficult preservation of quantum dots, slow photocuring rate, and failure of quantum dots, etc., to achieve improved photoinitiation High efficiency, high curing efficiency and fast curing speed
CN110437748BActive Publication Date: 2021-09-17TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN ZHONGHUAN ELECTRONICS LIGHTING TECH
Publication Date
2021-09-17

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Abstract

The invention relates to the field of packaging materials, and specifically provides a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. The encapsulant is mainly prepared from the following raw materials in parts by mass: 40-60 parts of difunctional acrylate, 10-30 parts of trifunctional acrylate, 10-50 parts of acrylate prepolymer, ultraviolet photoinitiator 1‑15 parts and photosensitizer 1‑8 parts. The packaging adhesive has the advantages of high curing efficiency, fast curing speed, environmental protection and low cost, and does not require high temperature during curing, and will not quench the quantum dots.
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Description

technical field

[0001] The invention relates to the field of packaging materials, in particular to a packaging glue and a preparation method thereof, a packaging body and a preparation method thereof. Background technique

[0002] Quantum dots are semiconductor nanostructures that bind excitons in three spatial directions. By applying a certain electric field or light pressure to quantum dots, they will emit light of a specific frequency, and have high photochemical performance and long fluorescence lifetime. , therefore, quantum dots have good application prospects in the fields of lighting and display. However, quantum dots are not easy to preserve. Quantum dot materials with a diameter of usually only 2-20 nanometers are afraid of water, oxygen, and heat. Therefore, they need to be packaged before application to prolong their service life.

[0003] There are two main encapsulation methods at present: one is to encapsulate quantum dots with traditional encapsulation glue,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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