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Modified diamond particles, modification method and application as reinforced phase and obtained metal-based composite material

A diamond particle and modification technology, applied in the field of composite materials, can solve the problems of poor metal-based diamond interface bonding and other problems, and achieve the effects of good adhesion strength, smooth coating surface, and improved surface

Active Publication Date: 2019-11-12
苏州博志金钻科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problem of poor bonding of the metal-based diamond interface, to provide a modified diamond particle, a modification method, an application as a reinforcing phase, and a metal-based composite material obtained

Method used

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  • Modified diamond particles, modification method and application as reinforced phase and obtained metal-based composite material
  • Modified diamond particles, modification method and application as reinforced phase and obtained metal-based composite material
  • Modified diamond particles, modification method and application as reinforced phase and obtained metal-based composite material

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Embodiment 1

[0040] Weigh 50g of diamond powder (with a particle size of 100-150μm) with an analytical balance, first put the diamond particles into an acetone solution, and clean them with ultrasonic vibration for 0.5h to remove hydrocarbons, then wash them with deionized water until neutral ; Then place the diamond particles in a 10g / L NaOH solution, clean them with ultrasonic vibration for 0.5h, clean and degrease, take them out and clean them with deionized water to neutrality; then place the diamond particles in 10% HNO 3 In the process, ultrasonic vibration was used to clean for 0.5h, and the cleaning was roughened. After taking it out, it was washed with deionized water until it was neutral; finally, the diamond particles were placed in an oven to dry.

[0041] Vacuum rolling coating equipment is used to put the pretreated diamond particles into the drum. During the deposition process, the rotating speed of the drum is guaranteed to be 20r / min to ensure the vacuum degree in the vacuu...

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Abstract

The invention discloses modified diamond particles, a modification method and an application as reinforced phase and an obtained metal-based composite material and belongs to the field of composite materials. The modification method of the modified diamond particles adopts vacuum rolling coating equipment and the particles are stirred in a roller, so that the coating uniformity of the diamond particles is improved. By adopting a multi-arc ion coating process, plasmas are generated on the surface of a target material directly, so that energy of particles attached to a matrix is high, the coating compactness is high, and a carbide is formed more easily by a metal and the diamonds, and therefore, mechanical bonding is converted into metallurgical bonding, and the interface heat resistance canbe reduced greatly. By carrying out coating by means of a magnetron sputtering method, the surface of the multi-arc ion coating is improved, so that the surface is leveler, the flowability of the diamond particles is increased, the hot press molding ability is improved and formation of pores is reduced. On the other hand, the multi-arc ion coating metal is prevented from being diffused to a matrix metal, so that the heat conducting property of the matrix is reduced. According to the modified diamond particles, a coating is compact and is unlikely to fall off.

Description

technical field [0001] The invention belongs to the field of composite materials, and relates to a modified diamond particle, a modification method, an application as a reinforcing phase and an obtained metal matrix composite material. Background technique [0002] Heat sink materials for electronic packaging have experienced three generations of development, but they can no longer meet the increasing heat dissipation requirements of power devices. The heat dissipation problem has become a technical bottleneck in the development of the electronic information industry. Metal-based diamond composite material is a new type of heat sink material for electronic packaging. It has excellent properties of high thermal conductivity and low thermal expansion coefficient. hotspot. Diamond is the material with the highest thermal conductivity among natural substances. It has always been a research hotspot of heat dissipation materials, but its high price discourages researchers. With ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32C23C14/35C23C14/18C23C28/02C22C26/00
CPCC22C26/00C23C14/18C23C14/185C23C14/325C23C14/35C23C28/02
Inventor 梁冰宋忠孝朱晓东钱旦李雁淮周子轩
Owner 苏州博志金钻科技有限责任公司
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