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Manufacturing method for high-power-density LED carrier board

A production method and high-power technology, which are applied in circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of strong brittleness of ceramic substrates, not easy to thin, and expensive hole metallization. Good peel strength and satisfactory workability

Pending Publication Date: 2019-11-12
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the existing technology, there are the following technical problems: 1. The price of copper substrate is relatively expensive, and the price of aluminum substrate is relatively low, but it is more expensive than FR-4, and it is not easy to be thinned, and it is not easy to add layers to form a multi-layer structure, and it is difficult to drill and form Large; 2. The ceramic substrate is relatively brittle, and the drilling and plating process is more difficult than the metal substrate, and the hole metallization cost is expensive; 3. Conventional FR-4 is easy to process and multi-layered, but the heat dissipation performance and thermal stability are poor , can only meet the needs of some low-end products

Method used

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  • Manufacturing method for high-power-density LED carrier board

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Comparison scheme
Effect test

Embodiment 1

[0025] A method for manufacturing a high-power density LED carrier board, characterized in that it includes the following steps: material cutting → drilling → PTH → electroplating → solder resist plug hole → grinding → outer layer circuit → solder resist → surface treatment → post-process; The hole diameter of the hole processed by the drilling process is ≤1000u", the hole position accuracy is ±30um, and the CPK≥1.33.

[0026] Further, the drilling process uses 2 carrier boards / stack. When drilling, a white backing board is set under the carrier board, and a coated aluminum sheet cover board is placed above it.

[0027] Further, in the PTH and electroplating process, the screen plate of the plug hole is 40T, the plug hole is left standing for 3 hours, and pre-baked at 75° C. for 45 minutes, so that the fullness of the plug hole reaches 60%.

[0028] Further, the grinding process requires that the orifice ink should be ground clean, and the copper surface should not have obviou...

Embodiment 2

[0040] A method for manufacturing a high-power density LED carrier board, characterized in that it includes the following steps: material cutting → drilling → PTH → electroplating → solder resist plug hole → grinding → outer layer circuit → solder resist → surface treatment → post-process; The hole diameter of the hole processed by the drilling process is ≤1000u", the hole position accuracy is ±30um, and the CPK≥1.33.

[0041] Further, the drilling process uses 2 carrier boards / stack. When drilling, a white backing board is set under the carrier board, and a coated aluminum sheet cover board is placed above it.

[0042] Further, in the PTH and electroplating process, the screen plate of the plug hole is 30T, the plug hole is rested for 2 hours, and pre-baked at 65° C. for 35 minutes, so that the fullness of the plug hole reaches 40%.

[0043] Further, the grinding process requires that the orifice ink should be ground clean, and the copper surface should not have obvious frost...

Embodiment 3

[0055] A method for manufacturing a high-power density LED carrier board, characterized in that it includes the following steps: material cutting → drilling → PTH → electroplating → solder resist plug hole → grinding → outer layer circuit → solder resist → surface treatment → post-process; The hole diameter of the hole processed by the drilling process is ≤1000u", the hole position accuracy is ±30um, and the CPK≥1.33.

[0056] Further, the drilling process uses 2 carrier boards / stack. When drilling, a white backing board is set under the carrier board, and a coated aluminum sheet cover board is placed above it.

[0057] Further, in the PTH and electroplating process, the screen plate of the plug hole is 50T, the plug hole is rested for 4 hours, and the plug hole is pre-baked for 55 minutes at 80° C., so that the fullness of the plug hole reaches 70%.

[0058] Further, the grinding process requires that the orifice ink should be ground clean, and the copper surface should not h...

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Abstract

The invention provides a manufacturing method for a high-power-density LED carrier board. The method is characterized by comprising the following steps: a cutting step, a hole drilling step, a PTH step, an electroplating step, a solder mask hole plugging step, a grinding step, a outer layer circuit processing step, a welding resisting step, a surface treatment step, and a post process step; a holeprocessed via a drilling technology is less than or equal to 1000 u' in thickness, a hole position is + / - 30 um in accuracy, and CPK is greater than or equal to 1.33. According to the method, by controlling a processing flow and parameters of BT material LED lamp bead packaging substrate and adopting BT resin instead of FR-4, a metal substrate or a ceramic substrate, the method disclosed in the invention can meet requirements for middle and high quality LED carrier boards while a thermal conductivity coefficient is as high as 0.8 W / mK.

Description

technical field [0001] The invention belongs to the technical field of circuit board preparation for LEDs, and in particular relates to a method for manufacturing a high-power-density LED carrier board. Background technique [0002] COB (ChipOnBoard) is a packaging technology that pastes LED chips directly onto the PCB board with adhesive or solder, and then realizes the electrical interconnection between the chip and the PCB board through wire bonding. LED lamp bead packaging mainly considers heat dissipation life and cost issues. At present, the corresponding PCB technology has the following three categories: [0003] Metal substrate (aluminum substrate, copper substrate): dielectric thermal conductivity 1-10W / m·k; ceramic substrate: dielectric thermal conductivity > 20W / m·k; conventional FR-4: dielectric thermal conductivity about 0.4W / m·k. [0004] However, in the existing technology, there are the following technical problems: 1. The price of copper substrate is r...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/03
CPCH05K1/0373H05K3/00H05K3/0047H05K2203/0214
Inventor 龚程程刘德威李清春叶汉雄黄生荣
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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