Clean water grinding and polishing technology
A process, clean water technology, used in grinding/polishing equipment, abrasives, manufacturing tools, etc., can solve the problems of little silicon crystal and cermet materials, improve the leveling and bright effect, improve mechanical strength and wear resistance improve the performance of grinding and polishing
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[0116] In a preferred embodiment, the preparation method of polyurethane of the present invention comprises the following steps:
[0117] The raw materials for preparing the polyurethane described in the present invention are blended to obtain the polyurethane.
[0118] The second aspect of the present invention provides a method for preparing a polishing grinding disc as described above, comprising the following steps:
[0119] The polyurethane, the grinding agent and the solvent are mixed to obtain a colloid, the base cloth is soaked in the colloid, solidified, washed with water and dried to obtain the polishing grinding disc.
[0120] Preferably, the colloid of the present invention further includes a dispersant.
[0121] More preferably, the dispersant of the present invention accounts for 0.5-1 wt% of the colloid.
[0122] Further preferably, the dispersant of the present invention accounts for 0.8wt% of the colloid.
[0123] More preferably, the dispersant of the pres...
Embodiment 1
[0149] Embodiment 1 of the present invention provides a kind of clear water grinding and polishing process, comprises the following steps:
[0150] The first stage is to carry out 25min coarse grinding using the coarse grinding and polishing grinding disc, which includes 65wt% coarse grinding abrasive; the second stage is to use the fine grinding and polishing grinding disc to carry out 20min fine grinding, and the fine grinding and polishing The grinding disc includes 65wt% fine grinding abrasive; the third stage is polishing for 15 minutes using a fine polishing and polishing grinding disc, which includes 80wt% fine polishing abrasive.
[0151] The coarse grinding abrasive is green silicon carbide with a mesh number of 800 mesh; the fine grinding abrasive is zirconia with a mesh number of 3000; the fine polishing abrasive is cerium oxide with a particle size of 25 nm.
[0152] The polishing grinding disc comprises rough grinding polishing grinding disc, fine grinding polishi...
Embodiment 2
[0160] Embodiment 2 of the present invention provides a kind of clean water grinding and polishing process, comprises the following steps:
[0161] The first stage is to carry out 25min coarse grinding using the coarse grinding and polishing grinding disc, which includes 65wt% coarse grinding abrasive; the second stage is to use the fine grinding and polishing grinding disc to carry out 20min fine grinding, and the fine grinding and polishing The grinding disc includes 65wt% fine grinding abrasive; the third stage is polishing for 15 minutes using a fine polishing and polishing grinding disc, which includes 80wt% fine polishing abrasive.
[0162] The coarse grinding abrasive is green silicon carbide with a mesh number of 800 mesh; the fine grinding abrasive is zirconia with a mesh number of 3000; the fine polishing abrasive is cerium oxide with a particle size of 25 nm.
[0163] The polishing grinding disc comprises rough grinding polishing grinding disc, fine grinding polishi...
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