Electric conduction coating material, plating solution, and PCB circuit board and production method thereof

Abstract

The invention relates to an electric conduction coating material, a plating solution, and a PCB circuit board and a production method thereof, wherein the electric conduction coating material is prepared from 5-75% of electric conduction copper powder, 15-20% of a resin, 5-10% of a curing agent, and 5-15% of an auxiliary agent, wherein the plating solution is prepared from of 1% of copper sulfate,1% of an alkali, 4.5-5.5% of potassium sodium tartrate, 0.1% of ethylenediaminetetraacetic acid, 1% of formaldehyde, and 91.4-92.4% of purified water. According to the present invention, the electricconduction coating material is directly silk-screened on the PCB circuit of a substrate, baking curing is performed, the obtained material is placed into the plating solution, the plated material istaken out, and anti-oxidation treatment is performed, such that the obtained PCB circuit board has an ultra-low-resistance electric-conduction coating and good conductivity while the production process is substantially simplified, the production difficulty is reduced, the production cycle is shortened, the total cost of the PCB circuit board is substantially reduced, the market competitiveness isstrong, the production process is pollution-free, and the surrounding environment of the industrial zone can be substantially improved so as to benefit the people.

Description

technical field

[0001] The invention belongs to the technical field of PCB circuit boards and conductive materials, and in particular relates to a conductive coating, a plating solution, a PCB circuit board and a method for manufacturing a PCB circuit board. Background technique

[0002] At present, the existing PCB circuit board manufacturers all use the subtractive method to produce PCB boards, but the applicant found that the traditional subtractive method has the following problems and shortcomings.

[0003] 1. The process is cumbersome and the production efficiency is not high;

[0004] 2. High production technology requirements, difficult production and high cost;

[0005] 3. The investment in production equipment is large, and the workshop area is large. Contents of the invention

[0006] In order to solve the above-mentioned problems in the prior art, the present invention provides a method that can be directly screen-printed on the substrate, which greatly simpl...

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