Organosilicon modified epoxy acrylate adhesive for OLED with UV heating dual curing system and preparation method thereof

An epoxy acrylate and dual curing technology, applied in the direction of modified epoxy resin adhesives, adhesives, etc., can solve problems such as complex shapes, pores, uneven curing, etc., and achieve high bonding strength and small gaps between molecular chains , the effect of excellent flexibility

Inactive Publication Date: 2019-11-19
上海本诺电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a UV heating dual curing system organic silicon modified epoxy acrylate adhesive for OLED and its preparation method. The adhesive adopts UV heating dual curing system, which combines polysiloxane, epoxy resin and acrylic acid The advantages of ester not only improve the folding and curling ability, but also significantly improve the adhesion to the barrier layer and solve the problem of uneven curing and porosity of UV glue caused by OLED's complex shape, thickness and color system

Method used

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  • Organosilicon modified epoxy acrylate adhesive for OLED with UV heating dual curing system and preparation method thereof
  • Organosilicon modified epoxy acrylate adhesive for OLED with UV heating dual curing system and preparation method thereof
  • Organosilicon modified epoxy acrylate adhesive for OLED with UV heating dual curing system and preparation method thereof

Examples

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Embodiment 1

[0032] A UV heating dual curing system silicone modified epoxy acrylate adhesive for OLED, the raw material formula of the adhesive includes the following components and weight percentages:

[0033]

[0034] Silicone modified epoxy acrylate resin is silicone side chain graft modified epoxy acrylate resin, the molecular formula is as follows:

[0035]

[0036] Where n / m=1-8.

[0037] Epoxy acrylate is selected from CN2003NS of American Sartomer Company.

[0038] The reactive diluent is selected from trimethylol triacrylate and 1,6-hexanediol diacrylate.

[0039] The modifier is selected from polybutadiene dimethacrylate and low viscosity aromatic monoacrylate.

[0040] The photosensitizer is selected from 2-hydroxy-2-methyl-1-phenylacetone.

[0041] The thermal initiator is selected from benzoyl peroxide.

[0042] The stabilizer is selected from 2,6-di-tert-butyl-4-methylphenol.

[0043] The filler is selected from Degussa R202 and Deshan QS-40.

[0044] Its prepara...

Embodiment 2

[0051] A UV heating dual curing system silicone modified epoxy acrylate adhesive for OLED, the raw material formula of the adhesive includes the following components and weight percentages:

[0052]

[0053] Silicone modified epoxy acrylate resin is silicone main chain block modified epoxy acrylate resin, its molecular formula is as follows:

[0054]

[0055] Where n / m=1-8.

[0056] Epoxy acrylate is selected from CN117 of American Sartomer Company.

[0057] The reactive diluent is selected from pentaerythritol polyacrylate and 1,6-hexanediol diacrylate.

[0058] Modifiers include polybutadiene dimethacrylate, chlorinated polyester acrylates, and low viscosity aromatic monoacrylates.

[0059] The photosensitizer is selected from 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.

[0060] The thermal initiator is selected from benzoyl peroxide.

[0061] The stabilizer is selected from hydroquinone.

[0062] The filler is selected from Degussa R202.

[0063] Its prepara...

Embodiment 3

[0070] A UV heating dual curing system silicone modified epoxy acrylate adhesive for OLED, the raw material formula of the adhesive includes the following components and weight percentages:

[0071]

[0072] Silicone modified epoxy acrylate resins include:

[0073] a. Silicone side chain graft modified epoxy acrylate resin, its molecular formula is as follows:

[0074]

[0075] Where n / m=1-8.

[0076] b. Silicone main chain block modified epoxy acrylate resin, its molecular formula is as follows:

[0077]

[0078] Where n / m=1-8.

[0079] Epoxy acrylate is selected from CN2003NS of American Sartomer Company.

[0080] The reactive diluent is selected from pentaerythritol polyacrylate and trimethylol triacrylate.

[0081] The modifier is selected from polybutadiene dimethacrylate, chlorinated polyester acrylate and low viscosity aromatic monoacrylate. The photosensitizer is selected from 2-hydroxy-2-methyl-1-phenylacetone.

[0082] The thermal initiator is selected...

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Abstract

The invention relates to the technical field of OLEF packaging, especially to a organosilicon modified epoxy acrylate adhesive for an OLED with a UV heating dual curing system and a preparation methodthereof. The adhesive comprises, by weight, 20%-50% of organosilicon modified epoxy acrylate resin, 20%-50% of epoxy acrylate resin, 10%-30% of an active diluent, 5%-10% of a modifier, 0.5%-2% of a photosensitizer, 0.5%-2% of a thermal initiator, 1%-5% of a stabilizer, and 1%-5% of a filler. The adhesive adopts the UV heating dual curing system, combines the advantages of polysiloxane, epoxy resin and acrylate, is improved in folding and curling capability, is significantly improved in the bonding force with a barrier layer and solves the problems of uneven curing, porosity and the like of UVadhesives caused by complex shape, thickness and color systems of the OLED.

Description

technical field [0001] The invention relates to the field of OLED encapsulation, in particular to a silicone-modified epoxy acrylate glue. Background technique [0002] With the rapid development of the display industry, organic light-emitting diode (OLED) technology is the best choice for the development of display screens tending to narrow frames and full screens. Compared with traditional LEDs and OLEDs, the circularly polarized light can pass through the polarizer without loss, and the light efficiency is increased by 100%, achieving lower power consumption and higher image clarity and contrast. OLED can be folded and bent, has a viewing angle of nearly 180°, has the advantages of flexible display and large-area full-color display, and can be applied to almost any display field. [0003] At present, the flexible screen adopts the technology of installing thin film or graphene on top of the OLED device to encapsulate the OLED device. In order to improve the airtightness ...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J163/10
CPCC08L2203/206C08L2205/025C09J163/10C09J183/04C08L63/10C08L83/04
Inventor蒋路谣
Owner上海本诺电子材料有限公司