Chemical nickel plating system

Abstract

The invention relates to the field of nickel plating equipment, and discloses a chemical nickel plating system. The chemical nickel plating system comprising a nickel plating assembly, a medicine feeding assembly and a circulating assembly, wherein the medicine feeding assembly comprises a medicine feeding pipe and a zigzag medicine spraying pipe, and the zigzag medicine spraying pipe comprises alifting pipe, a parallel pipe, a descending pipe and a longitudinal spraying pipe; the first end of the medicine feeding pipe communicates with a medicine preparing cavity, the second end of the medicine feeding pipe communicates with the lifting pipe, and the lifting pipe, the parallel pipe, the descending pipe and the longitudinal spraying pipe communicates in sequence; the longitudinal sprayingpipe is arranged in a reaction cavity, and a plurality of first medicine spraying holes which are arranged at intervals are formed in the longitudinal spraying pipe, the circulating assembly comprises a medicine discharging pipe, a filter and a circulating pipe, the first end of the medicine discharging pipe communicates with the reaction cavity, and the second end of the medicine discharging pipe communicates with the first end of the filter. According to the chemical nickel plating system, the water pressure of a nickel plating qualified solution is enhanced, so that the nickel plating qualified solution is sprayed out, the flowing of the nickel plating qualified solution in the reaction cavity is enhanced, the effect of uniform circulation of the nickel plating qualified solution on the upper layer and lower layer is better achieved, and the uniformity of coating of the nickel plating finished product is improved.

Description

technical field [0001] The invention relates to the field of nickel plating equipment, in particular to an electroless nickel plating system. Background technique [0002] Electroless nickel plating is also called electroless plating, or self-catalyzed plating. The specific process refers to the process in which metal ions in aqueous solution are reduced by reducing agent and precipitated on the surface of solid substrate under certain conditions. This process is different from displacement plating, the coating can be continuously thickened, and the plating metal itself also has catalytic ability. The nickel plating solution of electroless nickel plating generally uses nickel sulfate, nickel acetate, etc. as the main salt, hypophosphite, sodium borohydride, borane, hydrazine, etc. as the reducing agent, and various additives are added. Work in high temperature acidic solution. The coating shows superiority in uniformity, corrosion resistance, hardness, weldability, magneti...

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Problems solved by technology

[0003] The current electroless nickel plating equipment is mainly an electroless nickel plating tank, which contains a large amount of nickel plating solution. Due to the large volume of the chemical nickel plating tank, generally about 2000L, the nickel plating solution in the chemical nickel plating tank is difficult to Mix evenly, resulting in differences in the temperature and concentration of the nickel plating solution at different positions, resulting in uneven coating of the product to be plated

Moreover, the used nickel-plating solution contains some impurities visible to the naked eye. Generally, in order not to affect the quality of the coating, it will not be recycled, but the used nickel-plating solution will be discharged into the sewer, resulting in a higher consumption of nickel-plating solution. Large, high cost of nickel plating and large discharge of nickel plating waste liquid

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