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A special sealant for quantum dot packaging and preparation method thereof

A quantum dot and sealant technology, which is applied in the field of special sealant for quantum dot packaging and its preparation, to achieve the effects of fast curing speed, strong adhesion, and excellent light aging resistance

Active Publication Date: 2022-03-22
DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the core technology of quantum dot optical film sealing materials is mainly in the hands of a few foreign companies (such as 3M, Dow, etc.), which is still blank in China, and downstream display manufacturers can only choose foreign companies for cooperation

Method used

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  • A special sealant for quantum dot packaging and preparation method thereof
  • A special sealant for quantum dot packaging and preparation method thereof
  • A special sealant for quantum dot packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A special sealant for quantum dot packaging, which includes the following components calculated in parts by weight:

[0042] (1) Component A:

[0043] 70 parts of organosilicon modified epoxy resin;

[0044] 15 parts of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate;

[0045] 15 parts of poly[(2-oxiranyl)-1,2-cyclohexanediol] 2-ethyl-2-(hydroxymethyl)-1,3-propanediol ether;

[0046] 4 copies of UVI 6976;

[0047] ITX 0.5 copies

[0048] (2) Component B:

[0049] 70 parts of polyurethane modified silicone resin;

[0050] 30 parts of dicyclopentadiene acrylate;

[0051] Darocur 1173 4 parts;

[0052] Wherein, the mass ratio of the A component and the B component is 3:1.

[0053] The preparation method of the special sealant for encapsulation of quantum dots described in this embodiment is as follows: component A and component B are uniformly mixed according to the mass ratio of 3:1 to obtain the special sealant for encapsulation of quantum dots.

Embodiment 2

[0055] A special sealant for quantum dot packaging, which includes the following components calculated in parts by weight:

[0056] (1) Component A:

[0057] 80 parts of organosilicon modified epoxy resin;

[0058] 20 parts of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate;

[0059] 4 copies of UVI 6976;

[0060] ITX 0.5 copies

[0061] (2) Component B:

[0062] 70 parts of polyurethane modified silicone resin;

[0063] 30 parts of dicyclopentadiene acrylate;

[0064] Darocur 1173 4 parts;

[0065] Wherein, the mass ratio of the A component and the B component is 3:1.

[0066] The preparation method of the special sealant for encapsulating quantum dots is the same as that in Example 1, and will not be repeated here.

Embodiment 3

[0068] A special sealant for quantum dot packaging, which includes the following components calculated in parts by weight:

[0069] (1) Component A:

[0070] 70 parts of organosilicon modified epoxy resin;

[0071] 30 parts of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate;

[0072] 4 copies of UVI 6976;

[0073] ITX 0.5 copies

[0074] (2) Component B:

[0075] 70 parts of polyurethane modified silicone resin;

[0076] 30 parts of dicyclopentadiene acrylate;

[0077] Darocur 1173 4 parts;

[0078] Wherein, the mass ratio of the A component and the B component is 3:1.

[0079] The preparation method of the special sealant for encapsulating quantum dots is the same as that in Example 1, and will not be repeated here.

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Abstract

The invention discloses a special sealant for quantum dot packaging and a preparation method thereof. The special sealant for quantum dot packaging includes the following components calculated in parts by mass: component A: 60 to 80 parts of silicone modified epoxy resin ; 20-40 parts of reactive diluent; 2-5 parts of photoacid generator; 0.2-0.6 parts of photosensitizer; component B: 60-80 parts of polyurethane modified silicone resin; 20-40 parts of acrylate reactive diluent ; 2-6 free radical photoinitiators; wherein, the mass ratio of the A component to the B component is 4:1-1:2. The special sealant for encapsulating quantum dots of the invention has good compatibility with quantum dots, has little effect on the fluorescent brightness of quantum dots, has excellent aging resistance, good bonding performance, and excellent environmental reliability.

Description

technical field [0001] The invention relates to the field of quantum dot sealing materials, in particular, the invention relates to a special sealant for quantum dot packaging and a preparation method thereof. Background technique [0002] The emergence of quantum dot technology has enabled the upgrading of liquid crystal display technology and found a new breakthrough, which has attracted the attention of the industry. Since 2014, not only major international manufacturers such as Samsung and LG are using quantum dot technology to produce TV display screens, but local manufacturers such as BOE and my country Star Optoelectronics have also announced that quantum dot backlight technology products will soon be introduced into mass production. At present, there is still an important bottleneck in the large-scale application of quantum dot backlight technology, which is the lifetime of quantum dots, the main material. How to maintain a long fluorescence lifetime in the external...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J4/06H01L33/56
CPCC09J4/06H01L33/56
Inventor 成浩冠张小中黎松张亚平刘兆辉
Owner DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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