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A packaging method and packaging structure for an integrated antenna

A technology of integrated antenna and packaging method, which is applied in the directions of antenna support/installation device, antenna grounding switch structure connection, antenna, etc., can solve problems such as the limitation of the precision of integrated antenna preparation, achieve reduction in size, weaken flow impact, and effectively prepare Effect

Active Publication Date: 2021-10-15
江苏中科智芯集成科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to solve the problem that there are many limitations in the existing packaging methods of integrated antennas, which limit the manufacturing accuracy of integrated antennas

Method used

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  • A packaging method and packaging structure for an integrated antenna
  • A packaging method and packaging structure for an integrated antenna
  • A packaging method and packaging structure for an integrated antenna

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Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a packaging method for an integrated antenna, such as figure 1 shown, including the following steps:

[0036] Step S101: preparing an integrated antenna layer on a carrier.

[0037] here, as figure 2 As shown, the integrated antenna layer 2 includes an antenna 21 and a dielectric layer 22 covering the antenna 21 , and the interface of the antenna 21 is exposed outside the dielectric layer 22 .

[0038] Here, in order to remove the carrier 1 after performing all the steps of the method in the embodiment of the present invention and completing the preparation of the package structure of the integrated chip 3, as figure 2 As shown, a sacrificial layer 11 can be provided on the carrier 1 first, and then the integrated antenna layer 2 can be prepared on the sacrificial layer 11. Specifically, the sacrificial layer 11 can be an adhesive layer, for example, a high temperature bonding adhesive layer or a UV adhesive film Wait.

[0039]Here, a phot...

Embodiment 2

[0089] This embodiment provides a wafer-level fan-out packaging structure, which is prepared according to the above-mentioned embodiment 1 and its preferred implementation manners, and what has been explained will not be repeated here.

[0090] The packaging structure of the integrated antenna provided in this embodiment, such as Figure 7 As shown, it includes: an integrated antenna layer 2, a chip 3, a package body 4 and conductive pillars.

[0091] Among them, the integrated antenna layer 2 includes an antenna 21 and a dielectric layer 22 covering the antenna 21, and the antenna interface of the antenna 21 is exposed outside the dielectric layer 22; the package body 4 is arranged on the integrated antenna layer 2, and the chip 3 is packaged in the package body 4 , the device surface of the chip 3 is away from the integrated antenna layer 2; the package body 4 also includes a number of conductive columns, the conductive columns include the first conductive column 51 that ele...

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PUM

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Abstract

The invention discloses a packaging method and packaging structure of an integrated antenna. The method comprises the following steps: preparing an integrated antenna layer on a carrier; the integrated antenna layer includes an antenna and a dielectric layer covering the antenna, and the interface of the antenna is exposed outside the dielectric layer The chip is mounted on the integrated antenna layer, and a package is formed on the integrated antenna layer to encapsulate the chip; a number of conductive posts are formed in the package; the conductive post includes the first conductive post that electrically connects the antenna interface to the upper surface of the package. pillars and second conductive pillars electrically connecting the pads of the chip to the upper surface of the package. By first preparing the integrated antenna layer on the carrier, the preparation process of the antenna will not be limited by the preparation process or preparation conditions brought by other structures, making it possible to prepare high-precision, high-frequency antennas; and by combining the antenna with the chip Vertically integrated packaging, and finally obtain a smaller package structure.

Description

technical field [0001] The invention relates to the technical field of packaging of semiconductor integrated circuits, in particular to a packaging method and a packaging structure for integrated packaging of a chip and an antenna. Background technique [0002] The packaging structure of 5G high-frequency communication chips needs to integrate the antenna, RF front-end and transceiver into a single system-in-package. The advantage of integrating the antenna into the chip package is that it can simplify the system design, which is conducive to miniaturization and low cost. At present, there are many integrated antenna technologies emerging in the industry, such as integrated antenna design research based on various technologies such as ceramics, organic framework, and fan-out packaging. Among them, for the integrated antenna technology based on fan-out packaging technology, for a single-chip system, since the conductive interconnection between the chip and the antenna does n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/485H01L23/488H01L21/56H01L21/60H01Q1/22H01Q1/38H01Q1/50
CPCH01L21/568H01L23/3107H01L23/485H01L24/02H01L24/03H01L2224/0231H01L2224/0233H01L2224/02373H01L2224/02379H01Q1/2283H01Q1/38H01Q1/50H01L2224/18
Inventor 姚大平
Owner 江苏中科智芯集成科技有限公司