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A kind of aluminum nitride/nanometer silver solder paste heat conduction material and preparation method thereof

A heat-conducting material and nano-silver technology, applied in welding/cutting media/materials, welding equipment, manufacturing tools, etc., can solve problems such as easy agglomeration, difficult adhesion, gaps in nano-silver solder paste, etc.

Active Publication Date: 2021-09-14
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to different application devices, it is very easy to cause fatal problems such as cracks and fractures in the preparation process of nano-silver solder paste, which reduces the heat dissipation capacity
[0003] At present, there are a lot of researches on improving the thermal conductivity of nano-silver solder paste and reducing its sintering temperature, but the main way is to improve the sintering process and add reinforcement phase. The former process improvement cycle is long and the cost is high.
Although the latter has added reinforcing phases such as graphene and diamond in the prior art, due to the activity and inertness of the material itself, there are problems such as easy agglomeration and difficult adhesion during the preparation process, resulting in its sintering temperature, adhesion strength and The thermal conductivity still needs to be improved. At the same time, the combination between the reinforcement phase and the metal interface has also become a key factor in material preparation.

Method used

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  • A kind of aluminum nitride/nanometer silver solder paste heat conduction material and preparation method thereof
  • A kind of aluminum nitride/nanometer silver solder paste heat conduction material and preparation method thereof
  • A kind of aluminum nitride/nanometer silver solder paste heat conduction material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] (1) Add 0.8g of nano-aluminum nitride particles to 25ml of concentrated sulfuric acid solution, boil at 100°C for 8h, perform coarsening treatment, and then place them in 0.15mol / L SnCl 2 2H 2 The sensitization treatment was carried out in the sensitization solution of O, and finally placed in 0.025mol / LPdCl 2 Activation treatment is carried out in the concentrated hydrochloric acid (38wt%) mixed solution;

[0034] (2) Modifying the nano-aluminum nitride particles, adding 0.4 g of pretreated nano-aluminum nitride particles into 15 ml of pure ammonia solution at room temperature to obtain ammoniated nano-aluminum nitride particles. Then, a 0.1 mol / L silver nitrate aqueous solution was added dropwise to the analytically pure ammonia solution, and 0.15 g of sodium dodecylbenzenesulfonate was added thereto to obtain a mixed silver ammonia solution. Then add the ammoniated nano-aluminum nitride particles into the mixed silver-ammonia solution, perform magnetic stirring in ...

Embodiment 2

[0039] Other conditions were the same as in Example 1, and the properties of the materials prepared with different mass ratios of nano-aluminum nitride particles and mixed silver-ammonia solutions were tested. The experimental results are shown in Table 1.

[0040] Table 1 The performance of different nano-aluminum nitride particles and mixed silver-ammonia solution mass ratio on the performance of thermal conductive materials

[0041]

[0042] From the above results, it can be seen that the mass ratio of nano-aluminum nitride particles to mixed silver-ammonia solution is preferably 1:16

[0043] (Example 1).

Embodiment 3

[0045] Other conditions were the same as in Example 1, and the properties of the materials prepared with different mass ratios of silver-plated aluminum nitride particles to nano-silver paste were tested. The experimental results are shown in Table 2.

[0046] Table 2 The performance of different silver-plated aluminum nitride particles and nano-silver paste on the performance of thermal conductivity materials

[0047]

[0048] It can be seen from the above results that the mass ratio of silver-plated aluminum nitride particles to nano-silver paste is preferably 1:16 (Example 1).

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Abstract

The invention discloses an aluminum nitride / nano-silver solder paste heat-conducting material and a preparation method thereof. Nano-aluminum nitride plated with chemical silver on the surface is used as a reinforcing phase, and is doped in nano-silver solder paste to obtain the Thermally conductive material, the steps are: first pretreat the nano-aluminum nitride powder, then silver-plate the surface of the nano-aluminum nitride by chemical silver plating, and finally add the modified nano-aluminum nitride particles to the nano-silver material Mix in slurry. The invention overcomes the poor wettability of the surface of metal silver and aluminum nitride, has simple preparation process, and the obtained aluminum nitride / nanometer silver solder paste has high thermal conductivity and low sintering temperature.

Description

technical field [0001] The invention relates to the technical field of preparation of composite nanomaterials, in particular to an aluminum nitride / nano-silver solder paste heat-conducting material and a preparation process thereof. Background technique [0002] Due to the rapid development of the electronics industry, higher requirements are placed on the use of electronic packaging materials. It must not only have good mechanical properties, corrosion resistance, electrical insulation, but also have high thermal conductivity, low expansion coefficient and other advantages. However, traditional interconnection materials for chips and substrates have fatal defects of their own materials, making it difficult to meet the requirements. As a new type of interconnect material, nano-silver solder paste has excellent electrical and thermal conductivity, high melting point and low sintering temperature. However, due to different application devices, it is very easy to cause fatal ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40B23K35/22B23K35/24B23K35/36
CPCB23K35/22B23K35/24B23K35/36B23K35/40
Inventor 张平许晖周漫姜雄燕立培杨道国
Owner GUILIN UNIV OF ELECTRONIC TECH
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