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Device and method for preparing embedded laminated structure

A technology of laminated structure and preparation device, applied in coating devices, manufacturing auxiliary devices, processing and manufacturing, etc., can solve the problems of upper and lower structure asymmetry, low structure and shape accuracy, low efficiency, etc., to avoid upper and lower asymmetry, The effect of improving efficiency and convenient operation

Active Publication Date: 2019-12-10
NANJING VOCATIONAL UNIV OF IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The technical problem to be solved by the present invention is to overcome the defects that the existing preparation process of laminated structure is to manufacture parts layer by layer and then bond and form, the efficiency is low, the precision of the structure shape is low and the structure is asymmetrical up and down, and to provide a Embedded laminated structure preparation device and method

Method used

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  • Device and method for preparing embedded laminated structure
  • Device and method for preparing embedded laminated structure
  • Device and method for preparing embedded laminated structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1: a kind of embedded laminated structure preparation device, specifically as follows:

[0047] The upper nozzle 11 and the lower nozzle 12 are vertically arranged in parallel, both are made of conductive materials, and the inner diameter ranges from 50 μm to 1500 μm. The lower nozzle 12 is lower than the upper nozzle 1110 μm to 3000 μm. In this embodiment, a dispensing flat needle is used as the upper nozzle 11 , the lower shower head 12.

[0048]The single-edged blade 14 is arranged on the side of the lower nozzle 12 , and the blade tip 14 - 1 is located 10 μm to 3000 μm below the lower nozzle 12 . The length range of blade 14-2 is 2mm~50mm, and the value range of blade included angle α is 10°~60°. The alpha value is 30°.

[0049] An upper liquid storage tank 6 and an upper layer solution pump 7 are provided. The upper liquid storage tank 6, the upper layer solution pump 7 and the upper layer nozzle 11 are connected to each other. The upper layer liquid s...

Embodiment 2

[0060] Embodiment 2: A method for preparing an embedded laminated structure, using the device for preparing an embedded laminated structure provided in the above embodiment.

[0061] In this embodiment, the substrate 2 is PDMS, the upper layer solution is a PEO solution (12% concentration, the solute is PEO, the solvent is alcohol and distilled water, and the volume ratio is 1:1), the inner diameter of the upper nozzle 11 is 210 μm, and the lower layer solution is a PVDF solution (Concentration is 15%, solute is PVDF, solvent is acetone and DMF mixed solvent, volume ratio is 1:1), the inner diameter of the lower nozzle 12 is 260 μm, the lower nozzle 12 is located 50 μm below the upper nozzle 11, and the knife tip 14-1 is located in the lower nozzle 20 μm below 12. The positive pole of the high voltage power supply 8 is electrically connected to the upper nozzle 11 , and the negative pole of the high voltage power supply 8 is electrically connected to the lower nozzle 12 .

[...

Embodiment 3

[0070] Embodiment 3: A method for preparing an embedded laminated structure, using the device for preparing an embedded laminated structure provided in the above embodiment.

[0071] In this embodiment, the substrate 2 is PDMS, the upper layer solution is a PEO solution (15% concentration, the solute is PEO, the solvent is alcohol and distilled water, and the volume ratio is 1:1), the inner diameter of the upper nozzle 11 is 320 μm, and the lower layer solution is a graphite solution (the concentration is 13%, the solute is 99.5% high-purity flake graphite, the solvent is polyethylene oxide (PEO) and N-methylpyrrolidone (NMP), and the volume ratio is 1:1), the inner diameter of the lower nozzle 12 is 260 μm, and the lower nozzle 12 It is located 50 μm below the upper nozzle 11 , and the knife tip 14 - 1 is located 20 μm below the lower nozzle 12 . The positive pole of the high voltage power supply 8 is electrically connected to the upper nozzle 11 , and the negative pole of th...

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Abstract

The invention discloses a device and method for preparing an embedded laminated structure. The device comprises an upper layer spray head, a lower layer spray head, a single-edge blade, an upper layerliquid storage tank, an upper layer solution pump, a lower layer liquid storage tank, a lower layer solution pump, a moving platform, a substrate, an electrostatic shielding cover and a high-voltagepower supply. According to the device and the method, the upper layer nozzle and the lower layer nozzle are capable of achieving direct spraying synchronously; accurate positioning through high-voltage static electricity is carried out, so that the micro-nano level embedded laminated structure is efficiently prepared, thereby solving the problems of low efficiency, low structural shape precision,the up-and-down asymmetrical structure, large structural scale and the like of the prior art for preparing the embedded laminated structure.

Description

technical field [0001] The invention relates to the technical field of micro-nano structure preparation, in particular to a device and method for preparing an embedded laminated structure. Background technique [0002] Micro-nano-scale stacked structures are usually stacked by upper and lower layers of materials, which can be used to make upper and lower layers of stacked structures, and can be further processed into suspended structures, cantilever beam structures, etc., in MEMS devices, microfluidic chips, semiconductors, etc. It has wide application in other fields. [0003] Stacked structures are usually made using rapid prototyping technology, which uses computer-aided design to pre-plan the routing, and quickly materialize the design model by moving the pen tip or the substrate. Common rapid prototyping technologies include photocuring, selective laser sintering, and layered solid molding. [0004] Stereolithography (SLA) is currently the most mature and widely used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/106B29C64/205B29C64/30B33Y30/00B33Y40/00
CPCB33Y30/00B33Y40/00B29C64/106B29C64/205B29C64/30
Inventor 施渊吉于林惠杨歆睿
Owner NANJING VOCATIONAL UNIV OF IND TECH
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