High-weather-resistant low-temperature thermosetting epoxy module adhesive and preparation method thereof

A low-temperature heat, epoxy mold technology, used in epoxy resin adhesives, adhesives, non-polymer adhesive additives, etc., can solve problems such as large shrinkage, compatibility problems, and curing agents that cannot be cured. Achieve the effects of excellent water resistance, excellent bond strength and high stability

Active Publication Date: 2019-12-20
深圳市百丽春粘胶实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are certain problems in the low-temperature curing speed and stability of low-temperature heat-curing epoxy adhesives; general epoxy adhesives are characterized by good adhesion and good weather resistance, but they need to be cured at medium and high temperatures, and the shrinkage rate is relatively large; cationic curing Epoxy glue is also prone to compatibility problems, and the curing agent cannot be cured after being "poisoned"

Method used

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  • High-weather-resistant low-temperature thermosetting epoxy module adhesive and preparation method thereof
  • High-weather-resistant low-temperature thermosetting epoxy module adhesive and preparation method thereof
  • High-weather-resistant low-temperature thermosetting epoxy module adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A low-temperature thermosetting epoxy module glue with high weather resistance, its raw materials and composition are as follows (parts by weight):

[0043]

[0044]

[0045] Among them, YX-8000 is a hydrogenated bisphenol A epoxy resin purchased from Mitsubishi Chemical Co., Ltd., CE01MO is a cyanate-modified epoxy resin purchased from Yangzhou Tianqi New Materials Co., Ltd., and BPA328 is purchased from Nippon Shokubai. Co., Ltd.'s acrylate rubber particles are dispersed in a mixture of two-part A epoxy resin; amorphous silica R805 is a thixotropic agent purchased from Evonik Industrial Group; BYK-A530 is a methyl alkylpolyester purchased from BYK, Germany Silicone defoamer; Plenact AL-M is a coupling agent of diisopropylethoxy aluminum purchased from Ajinomoto Co., Ltd. of Japan.

[0046] The preparation method of accelerator C-1, comprises the following steps:

[0047] Add 16.5g of 3,3',4,4'-benzophenonetetraacid dianhydride and 150g of xylene under nitrogen ...

Embodiment 2

[0056] A low-temperature thermosetting epoxy module glue with high weather resistance, its raw materials and composition are as follows (parts by weight):

[0057]

[0058] Among them, CEL2021P is an aliphatic epoxy resin purchased from DAICEL Chemical Co., Ltd., CE01MO is a cyanate ester modified epoxy resin purchased from Yangzhou Tianqi New Materials Co., Ltd. The mixture of rubber particles dispersed in cycloaliphatic epoxy resin; amorphous silica R805 is a thixotropic agent purchased from Evonik Industrial Group; BYK-A530 is a methyl alkylpolysiloxane purchased from BYK, Germany Defoamer; Plenact AL-M is a coupling agent of diisopropylethoxy aluminum purchased from Ajinomoto Co., Ltd. of Japan.

[0059] The preparation method of accelerator C-1, comprises the following steps:

[0060] Add 16.5g of 3,3',4,4'-benzophenonetetraacid dianhydride and 150g of xylene under nitrogen atmosphere, and raise the temperature to 55°C, add 8.5g of 2-methylimidazole, stir at 55°C for ...

Embodiment 3

[0069] A low-temperature thermosetting epoxy module glue with high weather resistance, its raw materials and composition are as follows (parts by weight):

[0070]

[0071] Among them, YX-8000 is a hydrogenated bisphenol A epoxy resin purchased from Mitsubishi Chemical Co., Ltd., CE01MO is a cyanate-modified epoxy resin purchased from Yangzhou Tianqi New Materials Co., Ltd., and BPA328 is purchased from Nippon Shokubai. Co., Ltd.'s acrylate rubber particles are dispersed in a mixture of two-part A epoxy resin; amorphous silica H18 is a thixotropic agent purchased from Wacker Industry Group in Germany; BYK-A530 is a methyl alkyl group purchased from BYK in Germany Polysiloxane defoamer; PlenactAL-M is a coupling agent of diisopropylethoxyaluminum purchased from Ajinomoto Co., Ltd. of Japan.

[0072] The preparation method of accelerator C-1, comprises the following steps:

[0073] Add 16.5g of 3,3',4,4'-benzophenonetetraacid dianhydride and 150g of xylene under nitrogen atm...

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Abstract

The invention discloses a preparation method of a formula of a high-weather-resistant low-temperature thermosetting epoxy module adhesive. An epoxy resin is used as a main resin, and a diluent, a filler, a curing agent, an accelerator, a stabilizer, a thixotropic agent, a toughening agent, a defoaming agent, a coupling agent and a dispersant are added, and the adhesive is prepared by stirring anddispersing according to a certain proportion and corresponding production process requirements. The adhesive is suitable for camera module packaging, and the high-weather-resistant low-temperature thermosetting epoxy module adhesive has the advantages of high stability, rapid curing at low temperature conditions, high bonding strength, low shrinkage, good weather resistance, and high flexibility.The components in the formula are all halogen-free products, so that the adhesive meets environmental protection requirements.

Description

technical field [0001] The invention relates to the technical field of electronic device bonding, in particular to a low-temperature thermosetting epoxy module glue with high weather resistance and a preparation method thereof. Background technique [0002] In recent years, the smartphone market has been developing strongly. According to the International Data Corporation (IDC), the smartphone shipments reached 1.465 billion units in 2018. From 2019, the smartphone market will grow at an annual rate of 3%. According to IDC estimates, by 2022, shipments will reach 1.654 billion units. The popularity of the smart phone market has also driven the development of the mobile phone industry chain. As the most important application of smartphones, camera modules are also developing rapidly, and high-pixel cameras are favored by the market. The camera industry is developing in the direction of high precision and high pixels. [0003] As an important material in the camera industry,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
CPCC09J163/00C09J11/06C09J11/04C08K2003/265C08L2203/206C08L2201/22C08L2201/08C08K13/02C08K3/26C08K5/55C08K3/36
Inventor 叶明浩潘自鼎
Owner 深圳市百丽春粘胶实业有限公司
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