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Polyimide precursor composition and preparation method thereof
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A technology of polyimide precursor and composition, which is applied in the field of preparation of polyimide precursor composition, can solve problems such as unstable operation and difficult control, and achieve convenient and stable operation, convenient operation, and preparation system requirements not high effect
Inactive Publication Date: 2020-01-03
合肥中聚和成电子材料有限公司
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Problems solved by technology
[0004] The object of the present invention is to: provide a kind of polyimide precursor composition and preparation method thereof in order to solve the unstable operation in the prior art, not easy to control the problem
Method used
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Embodiment 1
[0039] Embodiment 1, a kind of polyimide precursor composition, obtain through polymerization reaction of diamine monomer and dianhydride monomer, described diamine monomer has following structural formula:
[0043] The preparation method of described a kind of polyimide precursor composition, comprises the steps:
[0044] D1: adding diamine monomers and dianhydride monomers to aliphatic amine cyclic compounds;
[0045] D2: Stirring the mixture of D1 while adding purified water to make it polymerize and prepare a polyimide precursor composition.
Embodiment 2
[0046] Embodiment 2, a kind of polyimide precursor composition, obtain through the polymerization reaction of diamine monomer and dianhydride monomer, described diamine monomer has following structural formula:
[0047]
[0048] The dianhydride monomer has the following structural formula:
[0049]
[0050] The preparation method of described diamine monomer comprises:
[0051] A1: diaminodiphenylmethane and anhydrous Na 2 CO 3 Pour into the organic solvent respectively;
[0052] A2: heating the mixture of A1 to completely dissolve the solid raw material into the organic solvent to form a mixed solution;
[0054] A4: Pour the obtained product of A2 into the obtained product of A3, and stir and mix evenly;
[0055] A5: The product obtained in A4 was subjected to cooling treatment, and a white solid was precipitated in the solution, and then obtained by suction filtration;
[0056] A6:...
Embodiment 3
[0066] Embodiment 3, a kind of polyimide precursor composition, obtain through polymerization reaction of diamine monomer and dianhydride monomer, described diamine monomer has following structural formula:
[0067]
[0068]The dianhydride monomer has the following structural formula:
[0069]
[0070] The preparation method of described diamine monomer comprises:
[0071] A1: diaminodiphenylmethane and anhydrous Na 2 CO 3 Pour into the organic solvent respectively;
[0072] A2: heating the mixture of A1 to completely dissolve the solid raw material into the organic solvent to form a mixed solution;
[0074] A4: Pour the obtained product of A2 into the obtained product of A3, and stir and mix evenly;
[0075] A5: The product obtained in A4 was subjected to cooling treatment, and a white solid was precipitated in the solution, and then obtained by suction filtration;
[0076] A6: The ...
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Abstract
The present invention discloses a polyimide precursor composition. The polyimide precursor composition is obtained by carrying out a polymerization reaction on a diaminemonomer and a dianhydride monomer, wherein a preparation method of the diaminemonomer comprises the following steps: A1, respectively pouring diaminodiphenyl methane and anhydrous Na2CO3 into an organic solvent; A2, heating the mixture in the A1 to make solid raw materials completely dissolved in the organic solvent to form a mixed solution; A3, pouring dichlorophenylphosphine into an organic solvent, and performing dissolution; A4, pouring the product obtained in the A2 into the product obtained in the A3, and performing uniform mixing under stirring; A5, cooling the product obtained in the A4 to precipitate a white solid from the solution, and performing suction filtration; and A6, performing column chromatography on the white solid by using a silica gel column to obtain the diamine monomer. Compared with traditional polyamide acid, the polyimide precursor composition provided by the invention has the advantages that a low molecular weight, smaller viscosity, and better operability; and meanwhile, a coating contains a less solvent, so that the soft baking time can be shortened, the soft baking temperature can be reduced, and the volume shrinkage phenomenon caused by volatilization of a large amount of solvent can be reduced.
Description
technical field [0001] The invention belongs to the technical field of polyimide precursor composition preparation, in particular to a polyimide precursor composition and a preparation method thereof. Background technique [0002] Polyimide has always been the first choice for high-performance polymer materials due to its excellent thermal stability and good mechanical, electrical and chemical properties. As far as printed circuit boards are concerned, in recent years, due to the emphasis on lightness, thinness, shortness and smallness of electronic products, the size of various electronic components must also become smaller and smaller. Under this development trend, light, thin And high temperature resistance and other characteristics and flexible printed circuit boards that can be mass-produced, there is more room for development. [0003] Flexible printed circuit boards are obtained by arranging circuits and other electronic components on flexible substrates. A cover fil...
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