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A combined eutectic welding device and its application method

A eutectic welding and combined technology, which is applied in welding equipment, auxiliary devices, manufacturing tools, etc., can solve the problems of difficult removal of redundant objects and difficult control of redundant objects, and achieve simple structure, improved welding efficiency, and guaranteed welding quality. Effect

Active Publication Date: 2021-06-25
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, because the soldering process is easy to produce excess, it is difficult to remove the excess, and the excess is not easy to control, so for the above technical requirements, the eutectic welding technology solution that does not generate excess in the welding process and has the advantages of no-cleaning should be preferred.
However, in the prior art, there is no suitable eutectic welding tool that can realize the welding of power substrate and non-power substrate and shell, and the integrated combination of power chip and substrate.

Method used

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  • A combined eutectic welding device and its application method
  • A combined eutectic welding device and its application method
  • A combined eutectic welding device and its application method

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Such as figure 1 , 3 As shown in and 4, a combined eutectic welding device includes a shell base 1 made of nickel-plated metal, and two sets of distributed lead holes 1a are provided on the shell base 1. Each group of lead holes 1a is distributed along the length direction of the housing base 1, and a raised non-power substrate 2 is provided on the housing base 1 between the two groups of lead holes 1a, and the non-power substrate 2 is a 96 ceramic substrate It is the carrier of the non-power part of the circuit.

[0045] A rectangular power substrate 3 is arranged on both sides of the protrusion on the upper part of the non-power substrate 2, and the power substrate 3 is made of aluminum nitride or other suitable materials. After the eutectic soldering is completed, the lead wires can be passed through the lead hole 1 a, and then soldered together with the non-power substrate 2 and the power substrate 3 .

[0046] A eutectic soldering chip base 4 is provided, and a ...

Embodiment 2

[0053] Such as figure 2 , 4 As shown in and 5, a combined eutectic welding device includes a shell base 1 made of nickel-plated metal, and two sets of distributed lead holes 1a are provided on the shell base 1. Each group of lead holes 1a is distributed along the length direction of the housing base 1, and a rectangular non-power substrate 2 is provided on the housing base 1 between the two groups of lead holes 1a. The non-power substrate 2 is a 96 ceramic substrate that is a circuit The carrier of the non-power part.

[0054] A rectangular notch is provided at the corner of one side of the upper part of the non-power substrate 2, and a corresponding rectangular power substrate 3 is provided at the notch, and the power substrate 3 is made of aluminum nitride or other suitable materials. . After the eutectic soldering is completed, the lead wires can be passed through the lead hole 1 a, and then soldered together with the non-power substrate 2 and the power substrate 3 .

...

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Abstract

The invention provides a combined eutectic welding device and its use method, which includes a shell base (1), on which a non-power substrate (2) and a power substrate (3) are arranged, and the non-power The substrate (2) and the power substrate (3) are correspondingly matched with the eutectic welding press block assembly (5), and a pair of rectangular press blocks (10) correspondingly matched with the eutectic welding press block assembly (5) are provided. The non-power substrate, power substrate and housing base are welded through the steps of eutectic soldering pretreatment, eutectic pre-soldering, solder sheet placement, and eutectic soldering. The invention is simple in structure, easy to use, and can realize the welding of power substrate, non-power substrate and shell at one time, and the eutectic welding of power chip and power substrate, which simplifies the process, improves the welding efficiency, ensures the welding quality, and is also a good solution for the later stage. Assembly provides assurance with respect to temperature gradients.

Description

Technical field: [0001] The invention belongs to the technical field of thick-film hybrid integrated circuit manufacturing technology, and specifically relates to a combined eutectic welding device for medium and low-power thick-film hybrid integrated circuits and its application method. Background technique: [0002] 96% AL is usually used in existing thick film hybrid integrated circuit substrates 2 o 3 Alumina ceramic substrates, substrates with power requirements often use aluminum nitride, beryllium oxide, copper clad laminates (DBC) and other materials, compared to 96% AL 2 o 3 Alumina ceramic substrates, these power substrates do not support multi-layer printing, cannot or are difficult to deposit thick film resistors, and have limitations, while ordinary alumina ceramic substrates have relatively weak thermal conductivity and heat dissipation performance, so they can be used in the design of thick film circuit structures The power part and the non-power part are d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K1/19B23K1/20B23K3/08B23K101/42
CPCB23K1/0008B23K1/19B23K1/20B23K3/08B23K3/087B23K2101/42
Inventor 李寿胜杨宝平夏俊生肖雷
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE