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Modified epoxy resin and preparation method thereof

A technology of epoxy resin and epoxy resin matrix, which is applied in the field of epoxy resin and can solve the problems of limiting the application range of epoxy resin and poor fracture toughness

Inactive Publication Date: 2020-01-17
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current epoxy resin has poor fracture toughness, which limits the application range of epoxy resin.

Method used

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  • Modified epoxy resin and preparation method thereof
  • Modified epoxy resin and preparation method thereof
  • Modified epoxy resin and preparation method thereof

Examples

Experimental program
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preparation example Construction

[0033] A preparation method of modified epoxy resin, comprising the steps of:

[0034] S1. Mix the modifying agent solution, epoxy resin, and curing agent uniformly to form a dispersed product.

[0035] In step S1, the modifying agent solution includes a solvent and a modifying agent dissolved in the solvent, and the modifying agent includes trifluoromethyl-containing polyimide. That is, a modifier solution can be obtained by dissolving a modifier in a solvent. Preferably, the solvent is dimethylacetamide.

[0036] Among them, the modifier can be obtained by self-preparation.

[0037] The following describes the preparation process of the modifier, which specifically includes the following steps:

[0038] S01. React 2-chloro-5-nitrobenzotrifluoride with hydroquinone at 125°C-135°C for 15h-18h to obtain the first product.

[0039] S02. Mix the first product and iron powder into ethanol, slowly add concentrated hydrochloric acid, heat the solution, stir for 2h-3h under hot r...

Embodiment 1

[0060] Preparation of trifluoromethyl-containing polyimide:

[0061]2-Chloro-5-nitrobenzotrifluoride, hydroquinone and solvent were uniformly mixed in a three-necked flask at room temperature, heated and stirred under a nitrogen atmosphere, heated from room temperature to 130°C and reacted for 16 hours. The solvent was distilled off under reduced pressure and poured into water to precipitate a precipitate, filtered and dried to obtain the first product.

[0062] Mix the first product and iron powder into ethanol, slowly add a small amount of concentrated hydrochloric acid, heat the solution, stir under reflux for 2 hours, then add a small amount of 10wt% ammonium hydroxide solution within 30 minutes, and suction filter to obtain the second product product, the second product was light yellow.

[0063] Mix the second product with 4,4'-biphenyl ether dianhydride and solvent, stir at room temperature for 4 hours, add triethylamine and acetic anhydride, stir at room temperature f...

Embodiment 2

[0067] The preparation of the polyimide containing trifluoromethyl group is the same as that in Example 1.

[0068] Dissolve 7.5g of trifluoromethyl-containing polyimide in 20ml of dimethylacetamide, add 100g of epoxy resin and 80g of curing agent, stir evenly with a glass rod, put it into an ultrasonic disperser for ultrasonic dispersion for 30min , then put the mixture into a vacuum oven, vacuumize and heat to 60°C to remove the solvent, then use a mechanical stirrer to continue stirring the mixture for 1 hour at a speed of 2000 rpm, then put it into a vacuum oven to vacuumize to remove air bubbles, and finally pour the pre- Put it into a hot polytetrafluoroethylene mold, put it in an oven, and heat it at 90°C, 110°C, and 130°C for 2h, 1h, and 4h, respectively, to obtain a modified epoxy resin, which is designated as A2.

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Abstract

The invention discloses a modified epoxy resin, which comprises an epoxy resin matrix and a modifier dispersed in the epoxy resin matrix, wherein the modifier comprises trifluoromethyl-containing polyimide. According to the invention, the modified epoxy resin uses the trifluoromethyl-containing polyimide as the modifier, and the trifluoromethyl-containing polyimide has good compatibility with theepoxy resin, so that the mechanical property, the thermal stability and the fracture toughness of the resin can be remarkably improved. The invention further discloses a preparation method of the modified epoxy resin.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin, and relates to a modified epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin, due to its good adhesion, corrosion resistance, electrical insulation, high strength and mechanical properties. Therefore, epoxy resin is widely used in the manufacture of various metal-nonmetal combinations, anti-corrosion coatings, electrical insulation materials, fiber-reinforced composite materials, etc. [0003] However, the current epoxy resins have poor fracture toughness, which limits the application range of epoxy resins. Contents of the invention [0004] Aiming at the deficiencies in the prior art, it is necessary to provide a new modified epoxy resin. [0005] A modified epoxy resin comprises an epoxy resin matrix and a modifier dispersed in the epoxy resin matrix, and the modifier includes trifluoromethyl-containing polyimide. [0006] Above-mentioned modified e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/14C08G81/00
CPCC08G59/1477C08G81/00
Inventor 嵇宇李媛媛张岩王萍
Owner SUZHOU UNIV
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