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Method for regulating and controlling wettability of rough copper surface through surface thermal oxidation

A technology of wetting performance and copper surface, applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problems of difficult control of copper surface wettability and high cost, and achieve strong bonding force, suitable for Wide-ranging, environmentally friendly effects

Active Publication Date: 2020-01-17
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is mainly aimed at the disadvantages of difficulty in controlling the wettability of the copper surface and high cost, and proposes in-situ thermal oxidation treatment to regulate the wettability of the rough copper surface.

Method used

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  • Method for regulating and controlling wettability of rough copper surface through surface thermal oxidation
  • Method for regulating and controlling wettability of rough copper surface through surface thermal oxidation
  • Method for regulating and controlling wettability of rough copper surface through surface thermal oxidation

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Embodiment 1

[0040] This embodiment relates to a method for regulating the wettability of a rough copper surface by surface thermal oxidation, comprising the following steps:

[0041] Step 1, cutting the C194 cold-rolled copper strip into required size, namely 70mm×50mm;

[0042] Step 2, put the cut substrate into the electrolytic degreasing solution with a current density of 5.0A / dm 2 , the degreasing time is 30s;

[0043] Step 3, soak the degreasing and cleaned substrate in 20% sulfuric acid solution for 30s, take it out and wash it with deionized water, this step is to remove the surface oxide and expose the fresh substrate at the same time;

[0044] Step 4, hanging the substrate into the plating solution prepared with deionized water for chemical deposition;

[0045] The composition of the plating solution is: copper sulfate pentahydrate (analytical pure, Sinopharm Chemical Reagent Co., Ltd., 0.03mol L -1 ); nickel sulfate hexahydrate (analytical pure, Sinopharm Chemical Reagent Co....

Embodiment 2

[0050] This embodiment relates to a method for regulating the wettability of a rough copper surface by surface thermal oxidation, comprising the following steps:

[0051] Step 1, cutting the C194 cold-rolled copper strip into required size, namely 70mm×50mm;

[0052] Step 2, put the cut substrate into the electrolytic degreasing solution with a current density of 1.0A / dm 2 , the degreasing time is 200s;

[0053] Step 3, soak the substrate after degreasing and cleaning in 15% nitric acid solution for 35s, take it out and wash it with deionized water, this step is to remove the surface oxide and expose the fresh substrate at the same time;

[0054] Step 4, hanging the substrate into the plating solution prepared with deionized water for chemical deposition;

[0055] The composition of the plating solution is: copper sulfate pentahydrate (analytical pure, Sinopharm Chemical Reagent Co., Ltd., 0.03mol L -1 ); nickel sulfate hexahydrate (analytical pure, Sinopharm Chemical Reage...

Embodiment 3

[0060] This embodiment relates to a method for regulating the wettability of a rough copper surface by surface thermal oxidation, comprising the following steps:

[0061] Step 1, cutting the C194 cold-rolled copper strip into required size, namely 70mm×50mm;

[0062] Step 2, put the cut substrate into the electrolytic degreasing solution with a current density of 10.0A / dm 2 , the degreasing time is 20s;

[0063] Step 3, soak the degreasing and cleaned substrate in 30% hydrochloric acid solution for 40s, take it out and wash it with deionized water, this step is to remove the surface oxide and expose the fresh substrate;

[0064] Step 4, hanging the substrate into the plating solution prepared with deionized water for chemical deposition;

[0065] The composition of the plating solution is: copper sulfate pentahydrate (analytical pure, Sinopharm Chemical Reagent Co., Ltd., 0.04mol L -1 ); nickel sulfate hexahydrate (analytical pure, Sinopharm Chemical Reagent Co., Ltd., 0.00...

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Abstract

The invention discloses a method for regulating and controlling the wettability of a rough copper surface through surface thermal oxidation, and belongs to the field of surface technologies. The method comprises the following steps that electrolytic polishing and acid pickling treatment is carried out on the surface of a copper sheet, and a rough structure is formed on the surface of the copper sheet by utilizing an electrochemical deposition technology; cleaning treatment is carried out on the copper surface of the rough structure; and heating treatment is carried out on the cleaned copper sheet, then the copper sheet is cooled to room temperature, and the wettability of the surface regulated is and controlled by controlling the temperature and the gas atmosphere, wherein the super-hydrophilic state has a contact angle of 0 degree, and the super-hydrophobic state can reach a contact angle of more than 160 degrees. The method has the advantages of being simple and convenient to operate, low in cost and capable of being widely applied to the fields of special wettable materials, intelligent sensors and the like.

Description

technical field [0001] The invention belongs to the field of surface technology, and in particular relates to a method for adjusting and controlling the wettability of a rough copper surface by surface thermal oxidation. Background technique [0002] Wettability is a very important property of the surface of solid materials, and the contact angle is a measure of the mutual wettability of solid-liquid surfaces. The size of the contact angle reflects the ability of the droplet to spread on the surface of the solid material and the ability of the droplet to maintain its shape on the surface of the solid material. A solid material has hydrophobic properties, which means that the water contact angle of water droplets on the surface of the solid material is greater than 90°, while a superhydrophobic surface refers to a surface with a water contact angle of not less than 150° and a rolling angle of not greater than 10°. [0003] Surface superhydrophobic and oleophobic functional f...

Claims

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Application Information

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IPC IPC(8): C23C8/02C23C8/12C23C18/48
CPCC23C8/02C23C8/12C23C18/48
Inventor 王淑慧吴蕴雯杭弢李明
Owner SHANGHAI JIAO TONG UNIV