Optical module capable of adopting liquid immersion type refrigeration as well as production method thereof

A technology of liquid immersion and production method, which is applied in the field of optical communication, can solve the problems affecting the optical path, difficult optical modules, unpredictable optical reflection, refraction, etc., and achieve the effects of high integration, simple assembly, and low production and testing costs

Active Publication Date: 2020-01-21
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional optical modules generally use alloy shells, optical components are non-hermetically sealed, and optical connectors are directly exposed; when this type of optical module is directly placed in a liquid-cooled environment, due to the strong penetration of the refrigerant liquid, the cooling The liquid will easily penetrate into the optical path of the optical element immediately, affecting the optical path, resulting in unpredictable optical reflection, refraction, etc.
Therefore, it is difficult for conventional optical modules to work normally in a liquid-cooled environment. How to effectively protect the optical path of the optical module is a problem that must be solved for optical modules used in liquid-cooled environments.

Method used

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  • Optical module capable of adopting liquid immersion type refrigeration as well as production method thereof
  • Optical module capable of adopting liquid immersion type refrigeration as well as production method thereof
  • Optical module capable of adopting liquid immersion type refrigeration as well as production method thereof

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Embodiment 1

[0036] An embodiment of the present invention provides an optical module that can adopt liquid immersion cooling, such as figure 1 with figure 2 As shown, the optical module is a QSFP+ packaged optical module, which mainly includes a PCB board 1 , an optoelectronic device 2 , an optical lens 3 and an optical connector 4 . The optoelectronic device 2 is directly mounted on the PCB 1, and the optical lens 3 is fixed above the optoelectronic device 2. Here, the optical lens 3 can be fixed on the optoelectronic device 2 by glue curing. Above, optical path transmission is realized; one end (ie, the left end in the figure) of the optical connector 4 is connected to the optical lens 3, and the other end (ie, the right end in the figure) is extended by an optical cable 5 with a pigtail. Wherein, the length of the optical cable 5 can be specifically determined according to the use requirements of the liquid cooling immersion depth.

[0037] The outside of the optical module is molde...

Embodiment 2

[0052] On the basis of the above-mentioned embodiment 1, the embodiment of the present invention also provides a method for manufacturing an optical module, which is used for manufacturing the optical module described in embodiment 1 that can adopt liquid immersion cooling. Such as image 3 As shown, the optical module manufacturing method provided by the embodiment of the present invention mainly includes the following steps:

[0053] Step 201 , connect and assemble the PCB board 1 , the optoelectronic device 2 , the optical lens 3 , the optical connector 4 and the optical cable 5 .

[0054] The specific assembly method can be combined with figure 1 , follow the steps below:

[0055] First, the optoelectronic device 2 is mounted on the PCB 1 , and the optical lens 3 is fixed above the optoelectronic device 2 . Wherein, the optoelectronic device 2 can specifically be mounted and fixed on the PCB board 1 where the heat conduction hole is provided, that is, the bottom of the ...

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Abstract

The invention relates to the technical field of optical communication, in particular to an optical module capable of adopting liquid immersion type refrigeration as well as a production method thereof. The optical module comprises a PCB, a photoelectric device, an optical lens and an optical connector, wherein the photoelectric device is mounted on the PCB, the optical lens is fixed above the optical device; one end of the optical connector is connected with the optical lens, and the other end of the optical connector is extended by adopting an optical cable provided with a tail fiber; and injection molding packaging is performed on the exterior of the optical module by adopting a low pressure injection molding material, and the low pressure injection molding material meets the conditionsthat an injection pressure is 1.5-40bar, an injection molding temperature is lower than 110 DEG C, viscosity with the PCB is higher than 3000mpa.s and impedance performance is matched with a high-speed signal line of the optical module. The optical module provided by the invention performs all-plastic packaging by adopting the low pressure injection molding material, is low in cost, high in integration level and simple to assemble, can be used in a liquid immersion environment for a long time and effectively prevents pollution of a refrigerating fluid on a light path part as well as interference on an optical access.

Description

【Technical field】 [0001] The invention relates to the technical field of optical communication, in particular to an optical module capable of adopting liquid immersion refrigeration and a manufacturing method thereof. 【Background technique】 [0002] At present, most of the optical modules used in data center communication are metal-packaged air-cooled optical modules, that is, the cooling system is all air-cooled, and the cooling medium is air. However, as the power consumption of optical modules increases, air cooling has become more and more difficult to meet the heat dissipation requirements of modules with greater power consumption; at the same time, in order to save energy and protect the environment, companies such as Google, Facebook, and Ali are vigorously developing liquid cooling For the optical module, it is hoped to use cooling liquid instead of air cooling. [0003] The use of liquid immersion cooling technology in data centers and high-performance computing ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42B29C45/14
CPCB29C45/14467G02B6/4251G02B6/4268
Inventor 林楠梅凯张尔康孙莉萍付永安高繁荣郭爱波杨佳倪鹏远韩志龙
Owner WUHAN TELECOMM DEVICES
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