IGBT module life monitoring method

A life and detection data technology, applied in the field of IGBT modules, can solve the problems of high modeling requirements, high detection circuit response time and precision requirements, and difficult data acquisition, so as to achieve the effect of improving safety and accuracy
CN110726921AActive Publication Date: 2020-01-24LEADRIVE TECH (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
LEADRIVE TECH (SHANGHAI) CO LTD
Publication Date
2020-01-24

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Abstract

The invention discloses an IGBT module life monitoring method. The IGBT module life monitoring method is characterized by comprising the following steps of: performing off-line calibration on a sampleof the IGBT module to obtain a calibrated sample; performing data analysis on the calibrated sample to obtain reference data and determine a preset deviation value; detecting the IGBT module before the operation of the IGBT module, and obtaining detection data; and comparing the detection data with the reference data, and determining whether a deviation value between the detection data and the reference data is greater than the preset deviation value, and if so, it is judged that the life of the IGBT module is about to end. By means of the IGBT module life monitoring method disclosed by the invention, the monitoring on the life of the IGBT module and a life ending warning can be realized by using a simple and efficient detection method; the IGBT module life monitoring method fully considers the module differences through calibration and statistics; and the IGBT module life monitoring method performs detection under a low voltage, and considers the influence of different junction temperatures, which greatly improves the safety and accuracy of life monitoring.
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Description

technical field

[0001] The invention relates to the field of IGBT modules, in particular to a method for monitoring the life of an IGBT module. Background technique

[0002] At present, in the actual application of the IGBT module, there are frequent power cycles due to the influence of various working conditions. During the working process, the chip is continuously heated and cooled, resulting in changes in the metal coating structure on the chip surface. Repeated micro-changes gradually accumulate, resulting in breakage, displacement or shedding of the bonding wires connected to the chip. Finally, the IGBT module Failure due to end-of-life, resulting in unexpected equipment downtime or greater accidents. Therefore, it is very important to monitor the aging condition of the IGBT module and issue a warning before the end of its life, and it is also a technical problem in this field.

[0003] In the prior art, a method for detecting the life of an IGBT is implemented throug...

Claims

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