High-density and highly integrated millimeter-wave tile-type phased antenna t/r components
A high-integration, phased-array antenna technology, which is applied to antennas, antenna arrays, and antenna arrays that are powered independently, can solve the problems of low integration, large space occupation, and high cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2021-06-15
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Abstract
Description
technical field
[0001] The invention relates to a high-density and high-integration millimeter-wave tile-type phased antenna T / R assembly (abbreviated as T assembly) component realization technology when the millimeter-wave transceiver co-aperture phased array antenna works in full duplex. Background technique
[0002] With the continuous development of device and process integration technology, and the continuous enrichment of electronic equipment functions in the detection and communication fields, the application of millimeter-wave phased arrays is becoming more and more extensive. The active phased array antenna is a commonly used antenna form. As the core module of the active phased array antenna, each channel integrates functions such as power amplification, phase shifting, and attenuation. In addition to functions such as RF amplification, phase shifting, and attenuation, a complete T / R component generally includes other control functions such as serial-to-parallel si...
Examples
Embodiment Construction
[0023] refer to Figure 1-Figure 2 . In the embodiment described below, a high-density and high-integration millimeter-wave tile-type phased array antenna T / R assembly includes: an upper-end multi-layer circuit board with a high-density and high-integration filtering function layer 7 and a vertical interconnection layer 8 2 and the microstrip patch antenna 1 arranged on the surface of the upper multilayer circuit board 2, and the chipset 3 distributed on both sides of the lower cavity 5 of the T / R component, nested in the lower cavity of the T / R component 5. The lower end multilayer circuit board 4 in the cavity and the radio frequency coaxial connector 6 fixed on the bottom. Wherein, the upper multilayer circuit board 2 includes microstrip patch antennas 1 distributed in a rectangular grid array on the top layer of the multilayer dielectric board, and the microstrip patch antenna 1 passes through the multilayer dielectric board and connects downwards to the inner The buried...