Thin-layer graphene/metal composite heat conducting film material and preparation method thereof, preparation method of metal salt intercalated graphene and electronic device

A thin-layer graphene and metal composite technology, applied in graphene, non-metallic elements, chemical instruments and methods, etc., can solve problems such as low thermal conductivity, and achieve the effect of good environmental protection and small environmental impact

Active Publication Date: 2020-01-31
严帆
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  • Application Information

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Problems solved by technology

[0004] The purpose of the embodiment of the present application is to provide a thin-layer graphene / metal composite heat-conducting film material and its preparation method, a method for preparing metal salt intercalated graphene, and an electronic device, which aims to improve the verticality of the existing graphene heat-conducting film. The problem of low directional thermal conductivity

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  • Thin-layer graphene/metal composite heat conducting film material and preparation method thereof, preparation method of metal salt intercalated graphene and electronic device
  • Thin-layer graphene/metal composite heat conducting film material and preparation method thereof, preparation method of metal salt intercalated graphene and electronic device
  • Thin-layer graphene/metal composite heat conducting film material and preparation method thereof, preparation method of metal salt intercalated graphene and electronic device

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preparation example Construction

[0054] The embodiment of the present application provides a method for preparing a thin-layer graphene / metal composite thermally conductive film material, including:

[0055] Place the sheet graphene and the heavy metal salt in a sealed environment, control the air pressure at 0.05 to 0.2 atmospheres, and heat the reaction until at least part of the heavy metal salt is inserted into the interlayer edge of the sheet graphene to form a metal salt intercalated graphene;

[0056] Mixing metal salt intercalated graphene and dispersant into a solution and then sanding to form a slurry;

[0057] Making the slurry into a thermally conductive film;

[0058] High-temperature alloying and graphitization are carried out on the heat-conducting film, so that the interlayer edges of the graphene sheet form a metal-carbon alloy.

[0059] During the intercalation process, low-pressure treatment is adopted, so that there is only intercalation at the edge of the graphene, and there is no interc...

Embodiment 1

[0119] The present embodiment provides a thin-layer graphene / metal composite heat-conducting film material, which is prepared in the following way:

[0120] Put 20 parts of graphene nanopowder with a thickness of 3nm and a sheet size greater than 10 microns and 1 part of anhydrous ferric chloride in a reaction kettle made of quartz, vacuumize to 0.1 atmospheric pressure, and keep it in an airtight state. Reactor is placed in the high-temperature environment of 380 ℃, reacts 15 hours, after being down to room temperature then, open reactor, obtain the graphene nanosheet of edge intercalation ( figure 1 XRD patterns). In parts by mass, after washing and drying 1 part of graphene nanosheets with edge intercalation made with clear water, add 400 parts of deionized water, add 1 part of polyvinylpyrrolidone (PVP) and 1 part of hydroxymethyl Cellulose (CMC) to obtain a mixture, then put the mixture into a sand mill for sand grinding and disperse for 10 hours, take it out and stir it...

Embodiment 2

[0122] This embodiment provides a kind of thin-layer graphene / metal composite heat-conducting film material, and its preparation steps are basically the same as embodiment 1, the difference is that the intercalation is changed to copper chloride ( image 3 The XRD spectrum of the graphene nanoplatelet of the edge intercalation of making is shown), vacuumized to 0.05 atmospheric pressure, ratio is 25 parts of graphene nanopowder and 2 parts of cupric chloride powder, reaction temperature is 450 ℃, reaction time 24 hours. The post-stage slurry preparation, coating, high-temperature annealing, calendering, and cutting processes are all the same as in Example 1, and the calendering density reaches 1.95g / cm 3 above.

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Abstract

The invention relates to the field of graphene materials, in particular to a thin-layer graphene / metal composite heat conducting film material and a preparation method thereof, a preparation method ofmetal salt intercalated graphene and an electronic device. The method comprises the following steps: placing the sheet graphene and the heavy metal salt in a sealed environment, controlling the air pressure to be 0.05-0.2 atmosphere and heating and reacting; then forming a slurry; manufacturing the slurry into a heat conducting film and then graphitizing the heat conducting film; low air pressuretreatment is adopted in the intercalation process so that intercalation only exists at the edge of graphene and there is no intercalation inside graphene; the obtained graphene heat conducting film has metal intercalation in the vertical direction of the graphene sheet layer and the metal salt ions are reduced by graphite to form metal-carbon alloy after high temperature alloying and graphitization treatment and the graphene sheet layer is lapped up, wherein the existence of the metal-carbon alloy can improve the vertical thermal conductivity of the graphene thermal conducting film.

Description

technical field [0001] The present application relates to the field of graphene materials, in particular, to a thin-layer graphene / metal composite heat-conducting film material and a preparation method thereof, a preparation method of metal salt intercalated graphene, and an electronic device. Background technique [0002] With the high integration of electronic device products, the products are getting thinner and thinner, the products are running faster and faster, and the heating phenomenon of equipment is becoming more and more serious. The heat dissipation problem has become an urgent problem to be solved in the current electronic device products. For a long time, traditional heat dissipation materials such as copper and aluminum have been widely accepted by people and are used in many fields such as LEDs, electrical switch cabinets, and mobile phones. However, the density of metal materials is relatively high, and the thermal conductivity is only 200-400w / mk. It is bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20C01B32/184C01B32/194
CPCC01B2204/24C01B32/184C01B32/194H05K7/2039
Inventor 郭玉芬刘兆平
Owner 严帆
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