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Dispersion liquid, composition, sealing member, light-emitting device, lighting fixture, display device, and manufacturing method of light-emitting device

A light-emitting device and dispersion liquid technology, applied in chemical instruments and methods, dyed high-molecular organic compound treatment, dyed low-molecular organic compound treatment, etc., can solve problems such as insufficient extraction efficiency, and achieve the effect of improving extraction efficiency

Active Publication Date: 2021-03-26
SUMITOMO OSAKA CEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The encapsulant may have a cured hardened body that is colored, so there is a problem that the extraction efficiency of light from the LED chip becomes insufficient.

Method used

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  • Dispersion liquid, composition, sealing member, light-emitting device, lighting fixture, display device, and manufacturing method of light-emitting device
  • Dispersion liquid, composition, sealing member, light-emitting device, lighting fixture, display device, and manufacturing method of light-emitting device
  • Dispersion liquid, composition, sealing member, light-emitting device, lighting fixture, display device, and manufacturing method of light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0167] (Preparation of dispersion liquid)

[0168] 10 g of zirconia particles (manufactured by Sumitomo Osaka Cement Co., Ltd.) with an average primary particle diameter of 5 nm, 82 g of toluene, and 5 g of methoxy-containing phenyl silicone resin (manufactured by Shin-Etsu Chemical Co., Ltd., KR217) as a surface modification material were added and mixed. . The mixed solution was set at a blade circumferential speed of 6.0 m / s and a cooling water temperature of 20° C., and was subjected to dispersion treatment with a bead mill for 6 hours to obtain the dispersion of Example 1. The power per unit mass obtained by dividing the power displayed in the bead mill device by the charged slurry amount during the dispersion treatment was 2.2 kW / kg.

[0169] (evaluation of particle size)

[0170] A part of the obtained dispersion liquid was extracted, and it diluted with toluene so that the solid content might become 5 mass %.

[0171] D50 of the diluted dispersion was measured using...

Embodiment 2

[0199] The dispersion liquid of Example 2 was obtained in the same manner as in Example 1, except that zirconia particles with an average primary particle diameter of 10 nm were used, the blade peripheral velocity was set to 5.0 m / s, and the cooling water temperature was set to 15°C. The power per unit mass obtained by dividing the power displayed in the bead mill device by the charged slurry amount during the dispersion treatment was 1.2 kW / kg.

[0200] In the same manner as in Example 1, the particle size, the content of the free surface modification material, and the chromaticity were measured. As a result, D50 was 45 nm, the content of the free surface modifying material was 48% by mass, L* was 81, a* was 1, and b* was 8. The results are shown in Table 1.

[0201] Except having used the dispersion liquid of Example 2 instead of the dispersion liquid of Example 1, it carried out similarly to Example 1, and obtained the composition, sealing member, and LED package of Exampl...

Embodiment 3

[0208] The dispersion liquid of Example 3 was obtained in the same manner as in Example 1 except that zirconia particles having an average primary particle diameter of 20 nm were used, the blade peripheral speed was set to 6.0 m / s, and the cooling water temperature was set to 20°C. The power expressed in the bead mill device at the time of dispersion treatment divided by the power per unit mass of the charged slurry amount was 2.4 kW / kg.

[0209] In the same manner as in Example 1, the particle size, the content of the free surface modification material, and the chromaticity were measured. As a result, D50 was 57 nm, the content of the free surface modifying material was 53% by mass, L* was 78, a* was −1, and b* was 14. The results are shown in Table 1.

[0210] Except having used the dispersion liquid of Example 3 instead of the dispersion liquid of Example 1, it carried out similarly to Example 1, and obtained the composition, sealing member, and LED package of Example 3. ...

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Abstract

The present invention provides a dispersion, a composition containing the same, a sealing member formed using the composition, a light emitting device having the sealing member, a lighting fixture and a display device including the light emitting device, and a method for manufacturing the light emitting device . The invention provides a dispersion liquid, which is used to seal light-emitting elements, and contains metal oxide particles with a refractive index of 1.7 or more and at least a part of surface modification materials attached to the metal oxide particles, obtained by a dynamic light scattering method The particle diameter D50 of the metal oxide particles when the cumulative percentage of the scattering intensity distribution is 50% is not less than 30 nm and not more than 100 nm, relative to the total content of the metal oxide particles and the surface modification material The content of the surface modifying material attached to the metal oxide particles is 60% by mass or less.

Description

technical field [0001] The present invention relates to a dispersion, a composition, a sealing member, a light-emitting device, a lighting fixture, a display device, and a method for producing a light-emitting device including metal oxide particles having a refractive index of 1.7 or more attached to a surface-modifying material. Background technique [0002] Light emitting diodes (Light Emitting Diodes, LEDs) are widely used as light sources having advantages such as miniaturization, long life, and low-voltage driving. The LED chip in the LED package is usually sealed with a resin-containing sealing material in order to prevent contact with deterioration factors existing in the external environment such as oxygen and moisture. Therefore, the light emitted from the LED chip passes through the sealing material and is emitted to the outside. Therefore, in order to increase the luminous flux emitted from the LED package, it is important to efficiently extract the light emitted...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56C08K9/06C08L101/00C09C1/00C09C3/08H01L23/29H01L23/31
CPCC08K9/06C09C3/08H01L33/56C09C1/3684C09C3/12C09C1/043C09C1/24C09C1/407C01P2006/60C01P2006/62C01P2006/64C01P2004/64C09C3/006C09C1/3669C01P2006/22C01P2004/62C01P2006/63C01P2002/84H01L2933/005C08K2201/011C08K2003/2241C08K2003/2244C08L101/00C09C1/00C09C3/10
Inventor 原田健司大塚刚史
Owner SUMITOMO OSAKA CEMENT CO LTD