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Electroplating method and system of light-emitting diode support and light-emitting diode support

A technology of light-emitting diodes and electroplating nickel, which is applied in the direction of electrolytic process and electrolytic components, can solve the problems of reduced product quality, low thickness coating binding force, poor effect, etc., and achieve the effect of enhancing binding force and improving product quality

Inactive Publication Date: 2020-02-14
崇辉半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electroplating system is to first plate copper and nickel on the LED bracket, and finally to plate silver on the nickel layer. Since the LED bracket is made of copper, the effect of direct copper plating on the LED bracket is poor, resulting in a weaker bonding force of the thick coating. Low, reducing product quality

Method used

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  • Electroplating method and system of light-emitting diode support and light-emitting diode support
  • Electroplating method and system of light-emitting diode support and light-emitting diode support
  • Electroplating method and system of light-emitting diode support and light-emitting diode support

Examples

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Effect test

no. 1 example

[0057] figure 1 It is a schematic flow chart of the electroplating method of the LED bracket according to the first embodiment of the present invention, figure 2 It is a schematic cross-sectional view of the bracket after electroplating by the electroplating method of the light-emitting diode bracket according to the first embodiment of the present invention, as figure 1 and figure 2 As shown, the electroplating method of the light-emitting diode bracket includes:

[0058] Carry out micro-etching treatment to support 11, remove the oxide layer on the surface of support 11 and activate the surface of support 11; layer or impurities and activate the surface of the stent 11, and at the same time neutralize the alkaline film remaining on the surface of the stent 11, which is conducive to improving the bonding force between the subsequent metal plating layer and the stent 11.

[0059] Further, the parameters for the microetching treatment on the bracket 11 are:

[0060] Sulfuri...

no. 2 example

[0102] The present invention also relates to a light-emitting diode bracket 11, which is formed by using the electroplating method for the above-mentioned light-emitting diode bracket.

[0103] Such as figure 2 As shown, the body surface of the bracket 11 is covered with the first electroplated nickel layer 12, and the bonding force between the first electroplated nickel layer 12 and the electroplated copper layer 13 is strong, so after the treatment of alkali copper plating and acid copper plating, the electroplated copper layer 13 can be firm Groundly combined on the first electroplated nickel layer 12, it is beneficial to strengthen the binding force of the subsequent plating layer, and then improve product quality, the second electroplated nickel layer 14 is formed on the electroplated copper layer 13, the second electroplated nickel layer 14 and the electroplated copper layer 13 1. The binding force of the electroplated silver layer 15 is strong, so after the pre-silveri...

no. 3 example

[0105] The present invention also relates to an electroplating system for a light-emitting diode bracket, which adopts the above-mentioned electroplating method for a light-emitting diode bracket.

[0106] Figure 4 It is a structural schematic diagram of the electroplating system of the light-emitting diode bracket of the third embodiment of the present invention, as figure 1 , figure 2 and Figure 4 As shown, the electroplating system of LED support 11 comprises: feeding device 22, receiving device 33 and the microetching device 25 that is arranged between feeding device 22 and receiving device 33 successively, impact nickel electroplating device 26, alkali plating Copper device 27, nickel electroplating device 29 and silver plating device 32, wherein:

[0107] The bracket 11 output by the feeding device 22 passes through the micro-etching device 25, the impact nickel electroplating device 26, the alkali copper plating device 27, the electro-nickel plating device 29 and ...

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Abstract

Provided is an electroplating method of a light-emitting diode support. The electroplating method includes the steps of performing micro-etching treatment on the support to remove an oxidization layeron the surface of the support and activate the surface of the support, performing impact nickel electroplating treatment on the support to form a first electroplating nickel layer on the surface layer of the support, performing alkaline copper plating treatment on the support to form a electroplating copper layer on the first electroplating nickel layer, performing nickel plating treatment on thesupport to form a second electroplating nickel layer on the electroplating copper layer, and performing silver plating treatment on the support to form an electroplating silver layer on the second electroplating nickel layer. By means of the electroplating method of the light-emitting diode support, the first electroplating nickel layer is formed on the surface of the support before copper and silver electroplating, the binding force between the subsequent plating layers and the support can be effectively enhanced through the first electroplating nickel layer, and the product quality can be easily improved. The invention further relates to the light-emitting diode support and an electroplating system of the light-emitting diode support.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating method and system for a light-emitting diode bracket, and a light-emitting diode bracket. Background technique [0002] The manufacturing process of the existing surface-mounted light emitting diode (LED) is as follows: first, the metal sheet is punched and formed into a surface-mounted LED bracket, and then the formed surface-mounted LED bracket is electroplated. , slicing, packaging, injection molding, solid crystal, short-baking curing, wire bonding, dispensing, aging baking, tinning and other processes to complete the surface mount of LED chips, and then make surface mount luminous LED chips through testing, sorting and packaging Diode products. [0003] Among them, the electroplating of the surface-mounted LED bracket is one of the key links in the entire production of the surface-mounted light-emitting diode. The electroplating of the surface moun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/14C25D5/34C25D7/00C25D3/12C25D3/38C25D3/46C25D19/00
CPCC25D3/12C25D3/38C25D3/46C25D5/14C25D5/34C25D7/00C25D17/00
Inventor 郑建国罗小平
Owner 崇辉半导体(深圳)有限公司
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