Controllable multi-point active fluid heat dissipation system integrated on PCB

Abstract

The invention discloses a controllable multi-point active fluid heat dissipation system integrated on a PCB. The active fluid heat dissipation system is composed of an active fluid control device, a heat dissipation device and a fluid cooling device. All the devices are integrated on a PCB. The active fluid control device is mainly composed of a plurality of active control piezoelectric fluid valves and piezoelectric fluid pumps, wherein the active control piezoelectric fluid valves and the piezoelectric fluid pumps are integrated on a PCB and provided with annular surface boundaries. The heatdissipation device is mainly composed of a plurality of micro-channel heat sinks, electronic devices subjected to heat dissipation are placed above the micro-channel heat sinks respectively, and heatflow sensors are placed above the electronic devices respectively. The liquid cooling device is mainly composed of a liquid storage pool and heat dissipation fins or refrigeration pieces. The systemis suitable for being integrated on the PCB, can efficiently and continuously dissipate heat of a plurality of electronic components at different positions and in different areas on the PCB, and has the function of precisely controlling the flow rate, the flow velocity and the flow direction of fluid so as to achieve the purpose of realizing heat management of high-power and high-heat-flux electronic components.

Description

technical field [0001] The invention belongs to the technical field of controllable microfluid thermal management, and in particular relates to the integrated technology of an active fluid cooling system on a PCB. Background technique [0002] The thermal management of high-power and high-heat-flux electronic components (chips) is the core of the future development of electronic devices and the key to restricting the development of electronic devices (chips). With the gradual failure of Moore's Law, the emergence of 3D integrated electronic devices (chips), and the continuous development of electronic equipment (chips) towards miniaturization and high power density, while the performance is getting higher and higher, its energy consumption and heat dissipation The problem is also becoming more and more prominent. Thermal management of electronic devices (chips) has become a key technology to ensure product performance and life. [0003] In the 20 years since Tuckerman and ...

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Problems solved by technology

However, it does not disclose how to efficiently integrate fluid pumps with PCB substrates and microchannel heat sinks.

In addition, the structure of the single piezoelectric single crystal actuator adopted by the fluid pump limits the compression ratio of the pump cavity, and the improvement of the pump flow rate is also limited. When the system has multiple cooling points, the fluid pump cannot provide high-power Electronic component heat dissipation provides greater flow

[0004] Since scholars from various countries have not proposed an effective solution on how to integrate the fluid pump with the microchannel heat sink and other components, the mainstream fluid cooling system has the problems of weak control ability and low integration level, and for complex subdivisions on the PCB There are also problems in how to effectively dissipate the local hot spots generated when they work

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