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Substrate processing device and component inspection method for substrate processing device

A substrate processing device and inspection method technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as reduced device operation rate, abnormal pinholes, metal pollution, etc., and achieve reduction The effect of repair costs

Pending Publication Date: 2020-03-06
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned resin coating has the following problems due to long-term use: abnormalities such as pinholes (pinholes) occur, and particles caused by peeling of the resin are generated due to this, or metal elution occurs in the base part of the resin coating. metal pollution
[0008] However, in this method, it is difficult to timely detect abnormalities of components
In addition, there will be a problem that the device needs to be operated only for inspection (lower operation rate of the device)
In addition, there is also a problem that substrate processing is performed in a state where an abnormality exists between the time when an abnormality actually occurs in a device component and until the abnormality is detected by inspection.
In addition, since the degree of deterioration cannot be measured for each component, even if there are components in good condition that have not actually deteriorated, there is a problem that the entire component needs to be replaced (increased repair cost)

Method used

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  • Substrate processing device and component inspection method for substrate processing device
  • Substrate processing device and component inspection method for substrate processing device
  • Substrate processing device and component inspection method for substrate processing device

Examples

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Effect test

Embodiment 1

[0054] figure 1 is a schematic cross-sectional view showing the structure of the substrate processing apparatus 100 of this embodiment, figure 2 It is a schematic plan view showing the structure of the substrate processing apparatus 100 . also, figure 1 It is a schematic plan view showing a state in which the substrate W is held by a spin jig 120 described later, figure 2 A state in which the substrate W is not held by the spin jig 120 described later is shown.

[0055] The substrate processing apparatus 100 is a so-called single-sheet type processing apparatus for processing substrates W for semiconductor use one by one, and is used to rotate a circular silicon substrate at high speed and perform cleaning using a chemical solution and pure water. Drying is carried out after treatment. As the chemical solution, for example, SPM (mixture of sulfuric acid and hydrogen peroxide solution), ozone hydrogen peroxide solution (mixture of ozone and hydrogen peroxide solution), SC...

Embodiment 2

[0111] Next, a second embodiment of the present invention will be described. Figure 10 is a schematic cross-sectional view showing the substrate processing apparatus 200 of this embodiment, Figure 11 It is a schematic front view showing the configuration of main parts of the processing tank 210 . The substrate processing apparatus 200 is a so-called batch type apparatus, and the processing liquid is stored in the processing tank 210, the substrate W is immersed in the processing tank 210 using the lifter 230 for holding the substrate W, and the substrate W is cleaned. In the substrate processing apparatus 200 , a plurality of substrates W (hereinafter, a group of a plurality of substrates W is also referred to as a batch) is carried in and out of the apparatus by a transfer robot (not shown). In addition, the substrate processing apparatus 200 may also be a multi-layer device or a single-layer device, the multi-layer device uses different processing tanks for each processin...

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PUM

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Abstract

This substrate processing device uses a processing liquid to perform substrate processing. The substrate processing device has an inspection means that inspects components that constitute the substrate processing device for deterioration. The inspection means comprises: an imaging means that acquires image data for the components; a color information acquisition means that acquires color information for a component under inspection from the image data acquired by the imaging means; and a deterioration determination means that, on the basis of the acquired color information, determines the degree to which the component under inspection has deteriorated.

Description

technical field [0001] The invention relates to a substrate processing device for processing a substrate. More specifically, the present invention relates to a substrate processing apparatus provided with means for inspecting components and a method for inspecting components of the substrate processing apparatus. In addition, the substrate referred to in this specification includes, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for organic EL (electroluminescence; electroluminescence) substrates, substrates for optical disks, substrates for magnetic disks, and substrates for magneto-optical disks. , Photomask substrates, ceramic substrates, substrates for solar cells, etc. Background technique [0002] In the past, as this device, a batch (batch) type device and a sheet type device are widely known (such as patent document 1, patent document 2); tank, use the lifter (lifter) to hold the substrate to im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/304
CPCH01L21/02H01L21/304H01L22/12H01L22/24H01L21/67757H01L21/67057H01L21/67288H01L21/67023H01L22/26
Inventor 桥诘彰夫
Owner DAINIPPON SCREEN MTG CO LTD