Optoelectronic device with component which is surface-mounted on frame support structure, and reflective composite material for such device
A technology for optoelectronic devices and supporting structures, which is applied to circuit thermal devices, assembling printed circuits with electrical components, optical components, etc. The effect of improving the luminous efficiency
Active Publication Date: 2020-03-06
阿兰诺德股份有限两合公司
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
In addition, the intermetallic compound AuAl
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More brittle, so the contact will break more easily under mechanical load
Therefore, "purple spots" lead to a significant deterioration in the reliability of semiconductor structural elements or integrated circuits
Method used
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[0040] For the ensuing description it must be emphasized that the invention is not limited to the exemplary embodiment and at the same time not to all or a plurality of features in the described combination of features. Rather, each individual subfeature of the exemplary embodiment has inventive significance independently of all other features described together in this text and in combination with any suitable further features.
[0041] In the individual figures of the drawing, identical components are also always provided with the same reference numerals, so that they are also usually only described once in each case.
[0042] first by figure 1 It can be seen that the reflective composite material V according to the invention comprising a carrier 1 made of aluminum has an intermediate layer 2 of aluminum oxide on one side A of the carrier 1 and a reflective enhancing material applied on the intermediate layer 2. Multilayer system for optical effects3. Carrier 1 can have th...
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Abstract
The invention relates to an optoelectronic device (LV) and a reflective composite material (V) which is to be used in particular in said device and which comprises a support (1) consisting of aluminum, an intermediate layer (2) made of aluminum oxide located on one side (A) of the support (1), and a reflection-amplifying optically active multilayer system (3) which is applied over the intermediatelayer (2). The aim of the invention is to provide such a composite material (V) which has a high degree of reflectivity and which has an improved electric connectability when the component is surface-mounted, in particular using the chip and wire method. This is achieved in that the intermediate layer (2) consisting of aluminum oxide has a thickness (D2) ranging from 5 nm to 200 nm, and a layer (9) made of a metal or a metal alloy is applied onto the surface of the support (1) face (B) lying opposite the reflection-amplifying optically active multilayer system (3), said metal or metal alloy having a specific electric resistance of maximally 1.2 * 10<-1> ohm*mm2 / m at 25 DEG C, wherein the thickness (D9) of the layer (9) applied onto the surface ranges from 10 nm to 5.0 microns. For the optoelectronic device (LV) according to the invention, the frame structure (LF) comprises a metal material with an aluminum support (1), on the surface (A) of which a metal joint support (FA) that is notmade of aluminum is applied locally at the connection point (SP) of an electronic component (SMD) with a wire (D).
Description
technical field [0001] The invention relates to an optoelectronic device comprising a frame support structure for surface-mountable electronic structural elements, wherein the frame support structure comprises metallic material, and wherein the electronic structural elements are placed and mounted on a frame The upper side of the support structure and the frame support structure are electrically contacted by means of wires. [0002] The optoelectronic device may in particular be a light emitting device, wherein the metallic material preferably consists of a reflective composite material with an aluminum carrier and the electronic component is a light-emitting diode (LED) configured as a chip. [0003] The invention also relates to reflective composite materials for use in such devices. Background technique [0004] In DE 103 40 005 A1 a lighting device for emitting white light is described, which comprises an electrically insulating substrate not specified in detail with tw...
Claims
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IPC IPC(8): H01L33/62H01L33/60C23C4/08H05K3/34G02B5/08C23C24/04H05K3/32H05K1/02
CPCG02B5/085H05K1/111H01L33/62H01L33/60C23C4/06G02B5/0858H01L24/48H05K1/0209H05K3/202H05K3/328H01L2224/48091H01L2933/0016H05K2201/0338H05K2201/10106H05K2201/2054H01L24/32H01L24/73H01L24/85H01L2224/32245H01L2224/45144H01L2224/48247H01L2224/48257H01L2224/73265H01L2224/85205H01L2924/12035H01L2924/12041Y02P70/50H01L2924/00014H01L2924/00012H01L2924/00H01L33/486
Inventor 史帝芬·辛格勒
Owner 阿兰诺德股份有限两合公司