A Jet Printing Equipment Suitable for Selective Melting Forming under Wide Temperature Gradient
A printing equipment and selective technology, applied in metal processing equipment, processing and manufacturing, manufacturing tools, etc., can solve the problems of low production efficiency, difficult temperature control, poor sample accuracy, etc., to avoid shrinkage and shrinkage, shortening Time required, effect of increasing density and mechanical properties
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0026] see figure 1 , figure 2 and image 3 , the inkjet printing equipment suitable for selective melting and forming under wide temperature gradient provided by the present invention, said inkjet printing equipment includes an upper cover body 1, a lower cover body 2, a support plate 22, a water cooling tube 33, and two fans 34 , powder spreading assembly I, heating assembly II, spray prin...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com