A kind of water-resistant sandpaper and preparation method thereof
A sandpaper and sand planting technology, applied in the field of sandpaper, can solve the problems of low grinding efficiency, insufficient water resistance, and high brittleness of coarse-grained sandpaper, achieving good cutting ability, reducing employee health and environmental hazards, and good flexibility. Effect
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Embodiment 1
[0056] A kind of water-resistant sandpaper, comprising a base material and several abrasive materials 4 evenly planting sand on the base material, the base material includes a paper base layer 1, a primer layer 2 and a glue layer 3 arranged sequentially from bottom to top, the The lower part of the abrasive material 4 runs through the sizing layer 3 , the bottom end of the lower part of the abrasive material 4 is embedded in the primer layer 2 , and the upper part of the abrasive material 4 protrudes from the upper surface of the sizing layer 3 . That is, the lower part of the abrasive material 4 is embedded in the oversize layer 3 and the primer layer 2 , and the upper part of the abrasive material 4 protrudes from the oversize layer 3 and the undercoat layer 2 .
[0057] The abrasive material 4 is silicon carbide, the vertical section of the abrasive material 4 is an equiangular triangle, and the tip part of the upper part of the abrasive material 4 protrudes from the upper s...
Embodiment 2
[0080] The difference between this embodiment and above-mentioned embodiment 1 is:
[0081] Described compound glue layer 3 is made after being coated with compound glue, and described compound glue comprises the raw material of following weight portion:
[0082]
[0083] The coupling agent is 3-(2,3-glycidoxy)propyltrimethoxysilane; the wetting agent is polyoxyethylene fatty alcohol ether.
[0084] The defoamer is polyoxyethylene polyoxypropylene pentaerythritol ether; the solvent A is a mixture of absolute alcohol and water in a weight ratio of 1:1.8.
[0085] Described primer layer 2 is made after being coated with primer, and described primer comprises the raw material of following weight portion:
[0086] Epoxy resin E-51 52 parts
[0087] Polyamide resin 650 98 parts
[0088] 6 parts of solvent B.
[0089] The molecular weight of the polyamide resin 650 is 700, and the solvent B is a mixture of xylene, n-butanol and acetone in a weight ratio of 1:1:1.
[0090] The ...
Embodiment 3
[0102] The difference between this embodiment and above-mentioned embodiment 1 is:
[0103] Described compound glue layer 3 is made after being coated with compound glue, and described compound glue comprises the raw material of following weight portion:
[0104]
[0105] The coupling agent is 3-(2,3-glycidoxy)propyltrimethoxysilane; the wetting agent is Span-20.
[0106] The defoamer is a W090 type defoamer; the solvent A is a mixture of absolute alcohol and water in a weight ratio of 1:2.
[0107] Described primer layer 2 is made after being coated with primer, and described primer comprises the raw material of following weight portion:
[0108] Epoxy resin E-51 55 parts
[0109] Polyamide resin 650 100 parts
[0110] 8 parts of solvent B.
[0111] The molecular weight of the polyamide resin 650 is 800, and the solvent B is a mixture of xylene, n-butanol and acetone in a weight ratio of 1:1:1.
[0112] The silicon carbide is a modified silicon carbide that has been m...
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