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Copper electroplating leveler, preparation method thereof, and electroplating solution

A leveling agent and electroplating copper technology, which is applied in the field of applied electrochemistry, can solve the problems of high price, and achieve the effects of simple equipment, reduced complexity, and good adaptability

Active Publication Date: 2021-11-12
苏州清飙科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, this scheme has significant disadvantages
First of all, pulse power supply is required, which belongs to precision equipment, and the price is relatively expensive; secondly, for different hole sizes, different hole diameters, and different hole depths, it is necessary to explore the waveform parameters (peak height, pulse width, duty cycle, etc.), which requires a lot of research. Exploratory research; in addition, for different types and concentrations of electroplating additives, different acid-copper ratios, these waveform parameters also need to be adjusted

Method used

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  • Copper electroplating leveler, preparation method thereof, and electroplating solution
  • Copper electroplating leveler, preparation method thereof, and electroplating solution
  • Copper electroplating leveler, preparation method thereof, and electroplating solution

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preparation example Construction

[0050] The preparation method of the electroplating copper leveling agent according to the embodiment of the present invention comprises the following steps:

[0051] Step 1: Weigh the imidazole compound and dichloromethyl ether, put them into a flask of a rotary evaporator, and heat through a water bath while rotating to obtain intermediate 1.

[0052] The structural formula of the intermediate 1 is shown in (2) below:

[0053]

[0054] Its chemical reaction formula is as shown in following formula (5):

[0055]

[0056] Wherein, the imidazole compound may be selected from 1-vinylimidazole, N-ethylimidazole, 1,2-dimethylimidazole, 1-n-butylimidazole, or a mixture thereof.

[0057] Specifically, put the imidazole compound and dichloromethyl ether into the flask of a rotary evaporator with a molar ratio of 1:(0.8-1.2), heat it to 50-60° C. in a water bath, and carry out the process while rotating. After 2-4 hours of reaction, Intermediate 1 was obtained.

[0058] Step ...

Embodiment 1

[0083] First, 1-vinylimidazole and dichloromethyl ether were put into a flask of a rotary evaporator with a molar ratio of 1:1, heated to 50°C in a water bath, and reacted for 4 hours to generate intermediate 1.

[0084] Next, continue to add liquid bromine into the reaction system, the mole fraction of which is half of the mole fraction of 1-vinylimidazole, continue to heat up to 70°C, continue to rotate and stir, and fully react for 5 hours to generate intermediate 2.

[0085] Thereafter, continue to add phenylhydrazine to the reaction system, the mole fraction of which is the same as that of 1-vinylimidazole, maintain the temperature at 70°C, continue to rotate and stir, and fully react for 6 hours to generate intermediate 3.

[0086] Thereafter, feed high-purity oxygen into the rotary evaporator, maintain the temperature at 70°C, continue to rotate and stir, and fully react for 2 hours to obtain the target product, namely polyheterocyclic ammonium salt.

[0087] Finally, t...

Embodiment 2

[0089] The electroplating solution was prepared by using the polyheterocyclic ammonium salt obtained in Example 1.

[0090] First, prepare a base solution based on a mixed solution of copper sulfate pentahydrate and sulfuric acid, wherein the concentration of copper sulfate pentahydrate in the base solution is 100g / L, the concentration of sulfuric acid in the base solution is 200g / L, and the chloride ion The concentration in the base solution is 60mg / L.

[0091] Thereafter, the polyheterocyclic ammonium salt obtained in Example 1, sodium polydipropylenesulfonate disulfide as an accelerator, and tridecyl alcohol polyoxyethylene propylene ether as an inhibitor were added to the base solution.

[0092] Wherein, the concentration of the polyheterocyclic ammonium salt in the whole plating solution is 30ppm, the concentration of the accelerator in the whole plating solution is 10ppm, and the concentration of the inhibitor in the whole plating solution is 600ppm.

[0093] After mixi...

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Abstract

The invention provides an electroplating copper leveling agent, a preparation method thereof, and an electroplating solution, wherein the electroplating copper leveling agent is a polyheterocyclic ammonium salt. According to the electroplating copper leveling agent of the embodiment of the present invention, coordinate the basic solution (i.e. the basic electroplating liquid) and accelerator and inhibitor, with the current density of 2.0~3.0ASD to the through hole that diameter is 150~250um, depth is 800~ The 1200um through hole is electroplated and filled, and finally full copper filling can be achieved without any defects in the hole.

Description

technical field [0001] The invention relates to the technical field of applied electrochemistry, in particular to an electroplating copper leveling agent for full copper filling of through holes, a preparation method thereof, and an electroplating solution. Background technique [0002] In the field of packaging substrates, ceramic substrates are a new form of packaging, especially alumina ceramics and aluminum nitride ceramic substrates, which have the characteristics of high flatness, high thermal conductivity, and high insulation, and are used in many high-power devices. package. [0003] The electrical interconnection between the layers of the ceramic substrate is also realized through via holes, and there is a big difference between the ceramic substrate and ordinary FR4, PI and other materials, usually with a large hole diameter, usually 100-200 μm in diameter, and usually 600-1000 μm in hole depth , The thickness-to-diameter ratio can usually reach 3 to 5. Especially...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D7/04
CPCC25D3/38C25D7/04
Inventor 胡斌
Owner 苏州清飙科技有限公司
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