Electromagnetic shielding function chip, electromagnetic shielding film, and electromagnetic shielding method
An electromagnetic shielding film and electromagnetic shielding technology, applied in the direction of magnetic/electric field shielding, circuits, electrical components, etc., can solve the problems of poor shielding effect of the film layer, affecting chip heat dissipation, and no shielding gap at the adhesive connection
Active Publication Date: 2022-03-22
VITALNK IND SHENZHEN
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Problems solved by technology
[0003] Based on this, it is necessary to provide an electromagnetic shielding function chip and its electromagnetic shielding film layer and electromagnetic shielding method to solve the problems of the traditional communication chip electromagnetic shielding method affecting the heat dissipation of the chip, the presence of unshielded gaps in the adhesive connection, and the presence of film layers. Problems with poor shielding
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[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0027] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning...
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Abstract
The invention relates to an electromagnetic shielding function chip, an electromagnetic shielding film layer and an electromagnetic shielding method thereof. The electromagnetic shielding film layer includes a layered metal primer layer, a copper-nickel alloy layer and a stainless steel surface layer, and a chip base layer and a copper-nickel alloy layer. The transition connection between the metal layer and the copper-nickel alloy layer can improve the bonding force between the electromagnetic shielding target and the copper-nickel alloy layer, and is also conducive to the heat dissipation of the chip substrate. At the same time, the metal layer as a conductive layer has a certain electromagnetic shielding ability There is no unshielded gap between the layer and the chip substrate. The stainless steel surface layer and the copper-nickel alloy layer can form an eddy current effect and generate reflection on the interface between the shield and the protected space, making the overall electromagnetic shielding effect of the film layer better. The shielding frequency band is more comprehensive; on the other hand, the copper-nickel alloy layer has poor oxidation resistance, while the stainless steel surface layer has excellent corrosion resistance and high temperature resistance, so the stainless steel surface layer can also be used as a protective layer for the copper-nickel alloy layer.
Description
technical field [0001] The invention relates to the technical field of electromagnetic shielding, in particular to an electromagnetic shielding function chip, an electromagnetic shielding film layer, and an electromagnetic shielding method. Background technique [0002] Communication electronic products have been widely used in all walks of life. The use of communication electronic products can be seen everywhere in daily life, but it also brings ubiquitous electromagnetic interference. As the brain of communication electronic products, how to shield the communication chip from electromagnetic interference is an increasingly important issue in the 5G communication era of ultra-high speed, low latency, and huge data throughput. The traditional electromagnetic shielding method for communication chips uses a conductive layer as a shielding layer, which is attached to the chip through an adhesive layer. However, the traditional method has the problems of affecting the heat diss...
Claims
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IPC IPC(8): H05K9/00H01L23/552
CPCH05K9/0088H01L23/552
Inventor 王强薛涛王伟
Owner VITALNK IND SHENZHEN