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A kind of low-temperature flux and preparation method thereof

A flux, low temperature technology, used in welding equipment, welding media, manufacturing tools, etc., can solve problems such as molten droplets, softening and deformation of flexible substrates

Active Publication Date: 2021-04-30
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors have found that the following problems exist in the process of soldering electronic components: the pins of existing electronic components are coated with a tin layer, and the tin layer is easily oxidized to form an oxide film, and the melting point of the oxide film is higher than 200°C. Reliable soldering of electronic components and low-melting-point metal circuits requires melting the oxide film, but the existing flexible substrates are generally polymer materials, such as polyethylene (PE) film, polyethylene terephthalate (PET ) film, polyvinyl chloride (PVC) film, etc., the temperature they can withstand generally does not exceed 120°C. Exceeding their tolerance temperature will cause the flexible substrate to soften, deform or even form droplets, resulting in damage to the flexible circuit board.

Method used

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  • A kind of low-temperature flux and preparation method thereof
  • A kind of low-temperature flux and preparation method thereof
  • A kind of low-temperature flux and preparation method thereof

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preparation example Construction

[0059] Exemplarily, as figure 1 as shown, figure 1 The flow chart of the preparation method of the first low-temperature flux component provided by the embodiment of the present invention, the preparation method of the first low-temperature flux component includes:

[0060] Step S11, adding the capsule core material and capsule wall material of the low-melting point metal microcapsules into the solvent, mixing and heating to above the melting temperature of the capsule core material, stirring under the protection of an inert gas, and transferring to emulsification after the stirring is completed Carry out emulsification and dispersion in the machine, and obtain low melting point metal microcapsules after cooling.

[0061] Wherein, the faster the stirring rate and / or the longer the stirring time, the smaller the capsule core particle diameter of the low melting point metal microcapsules, the more serious the oxidation, the faster the emulsification rate and / or the longer the e...

Embodiment 1

[0086] First Low Temperature Flux Component

[0087]

[0088] Second Low Temperature Flux Component

[0089]

[0090]

Embodiment 2

[0092] First Low Temperature Flux Component

[0093] component name Substance type Dosage Low melting point metal microcapsules Gallium indium tin alloy + polyethylene oxide 23g Polyvinylpyrrolidone 0.65g Graphene Graphene 1.5g solvent Isopropanol 74.85g

[0094] Second Low Temperature Flux Component

[0095] component name Substance type Dosage metal salt Zinc chloride 5g activator lactic acid 5g Surfactant op20 4.5g Defoamer mineral oil defoamer 0.3g solvent Ether 85.2g

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Abstract

The invention provides a low-temperature soldering flux and a preparation method thereof, which relate to the technical field of soldering. The low-temperature flux provided by the present invention is formed by uniformly mixing two low-temperature flux components; wherein, one of the low-temperature flux components is composed of low-melting-point metal microcapsules, polyvinylpyrrolidone, graphene and a solvent; The core material of the melting-point metal microcapsule is a low-melting-point metal whose melting point is lower than that of the pad; another low-temperature flux component consists of metal salt, activator, surfactant, defoamer and solvent. The technical scheme of the invention can reliably weld the electronic components and the low-melting-point metal circuit at low temperature.

Description

technical field [0001] The invention relates to the field of soldering technology, in particular to a low-temperature soldering flux. Background technique [0002] With the rapid development of low-melting-point metal electronic circuit printing technology, it has become a reality to use room-temperature liquid low-melting-point metals (usually below 200°C) to make circuit boards, especially flexible circuit boards. Flexible circuit boards based on low-melting-point metals include flexible substrates, low-melting-point metal circuits and electronic components formed on the flexible substrates, such as LEDs, membrane switches, touch switches, resistors, capacitors, sensors, and the like. Wherein, the low-melting-point metal circuit is connected with pads, and the electronic components are welded on the pads. [0003] The inventors have found that the following problems exist in the process of soldering electronic components: the pins of existing electronic components are coa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/36B23K35/362B23K35/40
CPCB23K35/3613B23K35/362B23K35/40
Inventor 董仕晋白安洋
Owner BEIJING DREAM INK TECH CO LTD
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